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Amphenol Communications Solutions |
Part No. |
51915-139LF
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Description |
PwrBlade®, Power Connectors, 6P 16S 3ACP Right Angle Receptacle, Solder To Board
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77315-134-20LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions 2.54mm (0.100in) Pitch, Right Angle
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
51915-132LF
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Description |
PwrBlade®, Power Connectors, 12P 24S Right Angle Receptacle, Solder To Board
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95615-132LF
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Description |
Minitek® 2.00mm, Board to Board, Shrouded Vertical Header- Through Mount - Double row - 32 Positions - 2.00mm (0.079in) Pitch.
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Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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Part No. |
PSMN4R1-30YLC
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Description |
N-channel 30 V 4.35m logic level MOSFET in LFPAK using NextPower technology 90 A, 30 V, 0.0057 ohm, N-CHANNEL, Si, POWER, MOSFET, MO-235
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File Size |
305.41K /
15 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
68015-132HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 32 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
95615-130TRLF
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Description |
Minitek® 2.00mm, Board to Board, Shrouded Vertical Header- Through Mount - Double row - 30 Positions - 2.00mm (0.079in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68015-136HLF
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Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
51915-136LF
|
Description |
PwrBlade®, Power Connectors, 6P 16S 3ACP Right Angle Receptacle, Solder To Board
|
Tech specs |
|
|
|
Official Product Page
|
|
|
 |
Amphenol Communications Solutions |
Part No. |
68015-131HLF
|
Description |
BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 31 Positions, 2.54 mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
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Part No. |
PSMN2R6-30YLC
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Description |
N-channel 30 V 2.8m logic level MOSFET in LFPAK using NextPower technology N-channel 30 V 2.8mΩ logic level MOSFET in LFPAK using NextPower technology N-channel 30 V 2.8m? logic level MOSFET in LFPAK using NextPower technology
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File Size |
330.95K /
15 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
77315-135-20LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions 2.54mm (0.100in) Pitch, Right Angle
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Tech specs |
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Official Product Page
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