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Amphenol Communications Solutions |
| Part No. |
77311-418-33LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021833-09010T1LF
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| Description |
Minitek127®, Board to Board Stacking Header , Surface Mount, Double Row, 10 positions, 1.27mm (0.500in) pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021833-07816T1LF
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| Description |
Minitek127®, Board to Board Stacking Header , Surface Mount, Double Row, 16 positions, 1.27mm (0.500in) pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
91618-332LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Double row, Top Entry, 64 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021833-08010T1LF
|
| Description |
Minitek127®, Board to Board Stacking Header , Surface Mount, Double Row, 10 positions, 1.27mm (0.500in) pitch.
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| Tech specs |
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|
|
Official Product Page
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Amphenol Communications Solutions |
| Part No. |
77315-418-33LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions 2.54mm (0.100in) Pitch, Right Angle
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021833-08008T1LF
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| Description |
Minitek127®, Board to Board Stacking Header , Surface Mount, Double Row, 08 positions, 1.27mm (0.500in) pitch.
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| Tech specs |
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Official Product Page
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NXP Semiconductors N.V.
|
| Part No. |
LPC1815JBD144 LPC1817JBD144 LPC1825JET100 LPC1823JET100 LPC1833JBD144 LPC1813JET100
|
| Description |
32-bit ARM Cortex-M3 MCU??68kB flash, 136kB SRAM, LQFP144 package
32-bit ARM Cortex-M3 MCU??024kB flash, 136kB SRAM, LQFP144 package
32-bit ARM Cortex-M3 MCU??68kB flash, 136kB SRAM, TFBGA100 package
32-bit ARM Cortex-M3 MCU??12kB flash, 104kB SRAM, TFBGA100 package
32-bit ARM Cortex-M3 MCU??12kB flash, 136kB SRAM, Ethernet, LQFP144 package
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| File Size |
2,725.29K /
148 Page |
 View
it Online |
Download Datasheet
|
| |
|
|
Amphenol Communications Solutions |
| Part No. |
77311-118-33LF
|
| Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch.
|
| Tech specs |
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|
|
Official Product Page
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|
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Amphenol Communications Solutions |
| Part No. |
20021833-06020T4LF
|
| Description |
Minitek127®, Board to Board Stacking Header , Surface Mount, Double Row, 20 positions, 1.27mm (0.500in) pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
20021833-08506T1LF
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| Description |
Minitek127®, Board to Board Stacking Header , Surface Mount, Double Row, 06 positions, 1.27mm (0.500in) pitch.
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
|
|
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
| Part: 183NQ100 |
| Maker: IR |
| Pack: 模块 |
| Stock: Reserved |
| Unit price
for : |
|
50: $11.90 |
|
100: $11.30 |
| 1000:
$10.71 |
|
Email: oulindz@gmail.com |
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Contact us |
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