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  90136-2122 Datasheet PDF File

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    90136-1125 0901361125

Molex Electronics Ltd.
Part No. 90136-1125 0901361125
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 25 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 25 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901361303 90136-1303

Molex Electronics Ltd.
Part No. 0901361303 90136-1303
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.50K  /  4 Page

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    90136-1114 0901361114

Molex Electronics Ltd.
Part No. 90136-1114 0901361114
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 14 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 14 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.66K  /  4 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    90136-1112 0901361112

Molex Electronics Ltd.
Part No. 90136-1112 0901361112
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 12 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 12 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. G832MB130802122HR
Description 0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 4.7 mm, 80 Positions, Dual Row, BTB Vertical Plug SMT, 15u\\ Gold White.
Tech specs    

Official Product Page

    0901361107 90136-1107

Molex Electronics Ltd.
Part No. 0901361107 90136-1107
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. G832MC110602122HR
Description 0.80mm Board-to-Board 100Ω Connector, Pitch 0.8mm, Height 4.7 mm, 60 Positions, Dual Row, BTB Vertical Plug SMT, 15u\\ Gold Black.
Tech specs    

Official Product Page

    0901361301 90136-1301

Molex Electronics Ltd.
Part No. 0901361301 90136-1301
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 1 Circuit, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.74K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021221-00020D1LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 20 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    0901361332

Molex Electronics Ltd.
Part No. 0901361332
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 32 Circuits 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.41K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021221-00068D4LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 68 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    0901361330

Molex Electronics Ltd.
Part No. 0901361330
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.41K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021221-00030T8LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 30 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    90136-2306 0901362306

Molex Electronics Ltd.
Part No. 90136-2306 0901362306
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.43K  /  5 Page

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Amphenol Communications Solutions

Part No. 20021221-000A0T8LF
Description Minitek127®, Wire to Board connector, Shrouded vertical header, Surface Mount, Double Row, 100 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

    0901361106 90136-1106

Molex Electronics Ltd.
Part No. 0901361106 90136-1106
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 20021221-00030C4LF
Description Minitek127® 1.27mm Wire/Cable-to-Board Connector System, Shrouded vertical header, Surface Mount, Double Row, 30 Positions, 1.27mm (0.500in) Pitch.
Tech specs    

Official Product Page

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