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bondable Datasheet PDF File

For bondable Found Datasheets File :: 257 Search Time::1.235ms
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				Semikron International
Part No.	SKR2
OCR Text	...s Values 18,2 x 18,2 331,24 bondable (Al) solderable (Ag/Ni) Al, diameter 500 m tray 16 Unit mm mm2 pcs SKR (c) by SEMIKRON Rev. 0 - 02.10.2009 1 SKR 18,2 Qu bond This technical information specifies semiconductor devic...
Description	DIODE DIODE
File Size	80.22K / 2 Page	View it Online	Download Datasheet

				Vishay Siliconix
Part No.	PWB WPWB00010000D XPWB00010000D WPWB00010000F XPWB00010000F WPWB00010000G XPWB00010000G WPWB00010000H XPWB00010000H WPWB00010000J XPWB00010000J WPWB00010000K XPWB00010000K WPWB00010001D XPWB00010001D WPWB00010001F XPWB00010001F WPWB00010001G XPWB00010001G WPWB00010001H XPWB00010001H WPWB00010001J XPWB00010001J WPWB00010001K XPWB00010001K WPWB0001000AD XPWB0001000AD WPWB0001000AF XPWB0001000AF WPWB0001000AG XPWB0001000AG
OCR Text	bondable Product may not be to scale * Power: 1 W * Chip size: 0.070 inches square * Resistance range: 0.3 to 20 k * Oxidized silicon substrate for good power dissipation * Resistor material: Tantalum nitride, self-passivating The P...
Description	Thin Film Power Resistors Thin Film Power Resistors
File Size	100.60K / 3 Page	View it Online	Download Datasheet

				RHOPOINT COMPONENTS
Part No.	CC2520FC CC2015FC CC1512FC
OCR Text	...at sinking of applications with bondable termination Style WB solder Bond version hybrid applications with metallized back surfaceWB allWire Bond version surface the chip, includes metallized back the table may be specified for voltages mod...
Description	Type CC Low Resistance Precision Chip Resistors
File Size	535.82K / 2 Page	View it Online	Download Datasheet

				IRC - a TT electronics Company. http://
Part No.	MWR-MWC01GC-01-1000-F MWR-MWC01GC-01-1000-G MWR-MWC01GC-01-1000-J MWR-MWC01GC-01-1000-K MWR-MWC01GC-01-50R0-F MWR-MWC01GC-01-50R0-G MWR-MWC01GC-01-50R0-J MWR-MWC01GC-01-50R0-K MWR-MWC01GC-01-775R0-F MWR-MWC01GC-01-775R0-G MWR-MWC01GC-01-775R0-J MWR-MWC01GC-01-775R0-K MWR-MWC01GC-02-1000-F MWR-MWC01GC-02-1000-G MWR-MWC01GC-02-1000-J MWR-MWC01GC-02-1000-K MWR-MWC01GC-02-50R0-F MWR-MWC01GC-02-50R0-G MWR-MWC01GC-02-50R0-J MWR-MWC01GG-01-1000-F MWR-MWC01GG-01-1000-G MWR-MWC01GG-01-1000-J MWR-MWC01GG-01-1000-K MWR-MWC01GG-01-50R0-F MWR-MWC01GG-01-50R0-G MWR-MWC01GG-01-50R0-J MWR-MWC01GG-01-50R0-K MWR-MWC01GG-01-775R0-F MWR-MWC01GG-01-775R0-G MWR-MWC01GG-01-775R0-J MWR-MWC01GG-01-775R0-K MWR-MWC01GG-02-1000-F MWR-MWC01GG-02-1000-G MWR-MWC01GG-02-1000-J MWR-MWC01GG-02-1000-K MWR-MWC01GG-02-50R0-F MWR-MWC01GG-02-50R0-G MWR-MWC01GG-02-50R0-J MWR-MWC01GG-02-50R0-K MWR-MWC01GG-02-775R0-F MWR-MWC01GG-02-775R0-G MWR-MWC01GG-02-775R0-J MWR-MWC01GG-02-775R0-K MWR-MWC01GG-03-1000-F MWR-MWC01GG-03-1000-G MWR-MWC01GG-03-1000-J MWR-MWC01GG-03-1000-K MWR-MWC01GG-03-50R0-F MWR-MWC01GG-03-50R0-G MWR-MWC01SC-02-1000-F MWR-MWC01SC-02-1000-G MWR-MWC01SC-02-1000-J MWR-MWC01SC-02-1000-K MWR-MWC01SC-02-50R0-F
OCR Text	... with a choice of solderable or bondable termination finishes, the MWR series termination chips are suitable for solder attachment as well as chip and wire or ribbon attached hybrid circuits. Back side mounting is facilitated by an optional...
Description	TaNFilm Microwave Chip Resistor
File Size	422.15K / 2 Page	View it Online	Download Datasheet

				Microsemi Corporation
Part No.	MS8001 MS8002 MS8003 MS8004
OCR Text	bondable Chips Features Low-Noise Performance High Cut-off Frequency Passivated to Enhance Reliability Packaged Diodes and bondable Chips Applications Single and Balanced Mixers and Detectors Transceivers X, K and Ka B...
Description	GaAs Schottky Diodes
File Size	126.10K / 3 Page	View it Online	Download Datasheet

				IRC - a TT electronics Company. http://
Part No.	GUS-TSCALF-00-1002-B GUS-TSCALF-00-1002-C GUS-TSCALF-00-1002-D GUS-TSCALF-00-1002-F GUS-TSCALF-00-1002-G GUS-TSCALF-00-1002-J GUS-TSCALF-01-1002-B GUS-TSCALF-01-1002-C GUS-TSCALF-01-1002-D GUS-TSCALF-01-1002-F GUS-TSCALF-01-1002-G GUS-TSCALF-01-1002-J GUS-TSCALF-02-1002-B GUS-TSCALF-02-1002-C GUS-TSCB-00-1002-B GUS-TSCB-00-1002-C GUS-TSCB-00-1002-D GUS-TSCB-00-1002-F GUS-TSCB-00-1002-G GUS-TSCB-00-1002-J GUS-TSCB-01-1002-B GUS-TSCB-01-1002-C GUS-TSCB-01-1002-D GUS-TSCB-01-1002-F GUS-TSCB-01-1002-G GUS-TSCB-01-1002-J GUS-TSCB-02-1002-B GUS-TSCB-02-1002-C GUS-TSCB-02-1002-D GUS-TS8BLF-00-1002-B GUS-TS0BLF-00-1002-B GUS-TSCBLF-00-1002-B GUS-TS8BLF-00-1002-C GUS-TS0BLF-00-1002-C GUS-TSCBLF-00-1002-C GUS-TS8BLF-00-1002-D GUS-TS0BLF-00-1002-D GUS-TSCBLF-00-1002-D GUS-TS0A-03-1002-B GUS-TS0A-03-1002-C GUS-TS0A-03-1002-D GUS-TS0A-03-1002-F GUS-TS0A-03-1002-G GUS-TS0A-03-1002-J GUS-TS0A-02-1002-B GUS-TS0A-02-1002-C GUS-TS0A-02-1002-D GUS-TS0A-02-1002-F GUS-TS0A-02-1002-G GUS-TS0A-02-1002-J GUS-TS0A-01-1002-B GUS-TS0A-01-1002-C GUS-TS0A-01-1002-D GUS-TS0A-01-1002-F GUS-TS0A-01-1002-G GUS-TS0A-01-1002-J GUS-TS0A-00-1002-B GUS-TS0A-00-1002-C GUS-TS0A-00-1002-D GUS-TS0A-00-1002-F GUS-TS0A-00-10
OCR Text	...ofile footprint. The small wire-bondable chip package provides higher component density, lower resistor cost and high reliability. The tantalum nitride film system on silicon provides precision tolerance, exceptional TCR tracking, low cost ...
Description	Surface Mount TSSOP Resistor Networks
File Size	278.25K / 4 Page	View it Online	Download Datasheet

				Intersema Sensoric SA
Part No.	MS7201-A2
OCR Text	...63 mm 2 2 WIRE BONDING The bondable area is 100 x 100 m for the EPI pad and 100 x 285 m for the other pads. The location of the bonding pads is close to the top Pyrex glass edge reducing the possible size and angle of the bonding capil...
Description	PRESSURE SENSOR DIE (0-1 BAR) FOR HARSH ENVIRONMENT
File Size	227.07K / 4 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKR18
OCR Text	...s Values 16,3 x 18,2 296,66 bondable (Al) solderable (Ag/Ni) Al, diameter 500 m tray 20 Unit mm mm2 pcs SKR (c) by SEMIKRON Rev. 0 - 02.10.2009 1 SKR 16,3 x 18,2 Qu bond This technical information specifies semiconducto...
Description	DIODE
File Size	81.91K / 2 Page	View it Online	Download Datasheet

				Intersema Sensoric SA
Part No.	MS7212-A2
OCR Text	...63 mm 2 2 WIRE BONDING The bondable area is 100 x 100 m for the EPI pad and 100 x 285 m for the other pads. The location of the bonding pads is close to the top Pyrex glass edge reducing the possible size and angle of the bonding capil...
Description	PRESSURE SENSOR DIE (0-12 BAR) FOR HARSH ENVIRONMENT
File Size	199.64K / 5 Page	View it Online	Download Datasheet

				Intersema Sensoric SA
Part No.	MS721208
OCR Text	...89 mm 2 2 WIRE BONDING The bondable area is 100 x 100 m . The location of the bonding pads is close to the top Pyrex glass edge reducing the possible size and angle of the bonding capillary. Refer to the detail view D on the layout for...
Description	PRESSURE SENSOR DIE (0-12 BAR) FOR HARSH ENVIRONMENT
File Size	223.63K / 4 Page	View it Online	Download Datasheet

For bondable Found Datasheets File :: 257 Search Time::1.235ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |

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