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SGS Thomson Microelectronics
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Part No. |
AN1294
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OCR Text |
...to the copper slug using a high melting temperature (>280 c) tin solder alloy such as pb97.5sn1ag1.5. wire bond resin snpb alloy copper spreader depressed option
an1294 - application note 3/12 the process used to attach die to the slug i... |
Description |
POWERSO-10RF: THE FIRST TRUE RF POWER SMD PACKAGE
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File Size |
177.82K /
12 Page |
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it Online |
Download Datasheet |
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Avago Technologies Ltd.
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Part No. |
ACPM-7886-TR1 ACPM-7886-BLK
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OCR Text |
...mponents on the 250 200 150 100 melting point = 218?c suggested lead free reflow profile for snagcu solder paste 0 50 100 150 200 250 seconds ramp 1 preheat ramp 2 reflow cooling 50 peak = 250 5?c suggested board implementation notes: 1. ... |
Description |
Automotive Relays; V23134M0053C642 ( Tyco Electronics ) Automotive Relays; V23072C1061A308 ( Tyco Electronics ) Automotive Relays; V23134A1053C643 ( Tyco Electronics )
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File Size |
357.20K /
14 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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