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NXP[NXP Semiconductors]
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Part No. |
BAP70-04W
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OCR Text |
...mat of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Table 6: changed max value of reverse current from 20 nA t... |
Description |
Silicon PIN diode
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File Size |
39.44K /
7 Page |
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it Online |
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NXP Semiconductors N.V. NXP[NXP Semiconductors] Quanzhou Jinmei Electro...
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Part No. |
BAP70-05 BAP70-05-15 BAP70-05-2015
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OCR Text |
...mat of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Figure 2 replaced Product data sheet -
20061221
BAP7... |
Description |
Silicon PIN diode
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File Size |
39.48K /
7 Page |
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it Online |
Download Datasheet
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NXP[NXP Semiconductors]
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Part No. |
BAS16VY BAS16VV
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OCR Text |
...mat of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Table 2 "Quick reference data": indication per diode added... |
Description |
Triple high-speed switching diodes
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File Size |
70.27K /
12 Page |
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it Online |
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NXP[NXP Semiconductors]
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Part No. |
BAS21H
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OCR Text |
...mat of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Section 1.1 "General description": amended Table 1 "Quick ... |
Description |
Single high-voltage switching diode
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File Size |
54.01K /
10 Page |
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it Online |
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PHILIPS[Philips Semiconductors]
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Part No. |
BAS32L_05
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OCR Text |
...mat of this data sheet has been redesigned to comply with the new presentation and information standard of Philips Semiconductors. Section 4 "Marking" added Table 6 "Thermal characteristics" Rth(j-tp) thermal resistance from junction to tie... |
Description |
High-speed switching diode
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File Size |
55.16K /
11 Page |
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it Online |
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