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umc Datasheet PDF File

For umc Found Datasheets File :: 112 Search Time::1.547ms
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				Emerson Network Power
Part No.	305-0811Y-3 305-0811S-1 305-0811-5 305-0811-3 305-0811-2 305-0811-1 305-0486-3 305-0486-2 305-0486-1 305-0042Y-7 305-0042Y-4 305-0042Y-1 305-0042S-7 305-0042S-4 305-0042S-1 305-0042-9 305-0042-7 305-0042-4 305-0042-12 305-0042-11 305-0811-6 305-0811-7 305-0811S-2 305-0811S-3 305-0811Y-1 305-0811Y-2 PL220-011 BJ79MCS-213 PL75MCS-201 BJ79MCS-201 CJ70MCS-201 PL75MCS-213 CJ70MCS-213 CJ70-47 CJ70-60 CJ70-7 CJ70-9 PL75S-47 PL75MC-201 BJ79MC-201 CJ70MC-201 PL375MC-201 BJ379MC-201 CJ370MC-201 PL75-47 PL75-60 PL75-7 PL75-9 PL75MC213 PL75MCY-201 PL75MCY-213 PL75S-60 CJ370-60 CJ70Y-60 BJ79-60 BJ79-7 BJ376 BJ379-47 BJ379-7 CJ70MCY-213 PL375MC-213 CJ70MC-213 CJ70S-47 CJ70S-7 CJ70S-9 CJ70Y-47 CJ70Y-9
OCR Text	...rom ultra-miniature interfaces (umc), micro-miniature, (mcx, mmcx, smp), subminiature (sma, smb, smk, kwiqmate?), medium connectors (type n connectors) through to large connectors (din7/16). the breadth of products a...
Description	Military, Space and Testing Equipment
File Size	6,048.22K / 100 Page	View it Online	Download Datasheet

				INFINEON[Infineon Technologies AG]
Part No.	SLE66C82PM5 SLE66C82P SLE66C82PC
OCR Text	... Dresden (Germany) SLE 66CxxxP umc (Taiwan) SLE 66CxxxPU Altis (France) SLE 66CxxxPA 1 available as wire-bonded module (M5) for embedding in plastic cards or as die (C) for customer packaging Short Product Information 5/8 11...
Description	Security & Chip Card ICs
File Size	33.43K / 7 Page	View it Online	Download Datasheet

				ETC
Part No.	PCM5862E
OCR Text	...ndard Microsystems Corporation. umc is a trademark of United Microelectronics Corporation. VIA is a trademark of VIA Technology, Inc. IDT is a trademark of Intergrated Device Technology , Inc. All other product names or trademarks are prope...
Description	All in one multi-media Pentium processor-based single board computer
File Size	559.12K / 108 Page	View it Online	Download Datasheet

				INFINEON[Infineon Technologies AG]
Part No.	SLE66CX160S-C SLE66CX160S-T85-C SLE66CX160S-V5-C SLE66CX160S-V5-F7-C SLE66CX160S-V5-M6 SLE66CX160S-V5-T85-C SLE66CX160S-V5-T85-M6 SLE66CX160S SLE66CX160S-M6 SLE66CX160S-T85-M6 SLE66CX160S-V5-F7-M6
OCR Text	... * * Regensburg SLE 66CxxS umc Taiwan SLE 66CxxU 1 available as wire-bonded module (M6) for embedding in plastic cards or as die (C) for customer packaging Short Product Information 6/8 10.01 SLE 66CX160S Pin Configu...
Description	Security & Chip Card ICs 安全 CAP 180UF 25V 20% ALUM ELECTROLYTIC SECURITY & CHIP CARD ICS
File Size	37.05K / 8 Page	View it Online	Download Datasheet

				ETC[ETC]
Part No.	PCM5862EL PCM5862E PCM-5862E PCM-5862EL
OCR Text	...ndard Microsystems Corporation. umc is a trademark of United Microelectronics Corporation. VIA is a trademark of VIA Technology, Inc. IDT is a trademark of Intergrated Device Technology , Inc. All other product names or trademarks are prope...
Description	All in one multi-media Pentium processor-based single board computer
File Size	589.56K / 108 Page	View it Online	Download Datasheet

				Fujitsu
Part No.	MB90632A E713601 MB90634A
OCR Text	... SOT0 pin if the SOE bit in the umc register is "1". Can be set as an open-drain output port (OD41 = "1") by the open-drain control register (ODR4). The setting does not apply for ports set as inputs (D41 = "0": invalid at the input setting...
Description	F 2 MC-16L MB90630A Series From old datasheet system
File Size	729.51K / 107 Page	View it Online	Download Datasheet

				Alpha & Omega Semiconductors
Part No.	AOZ3013PI
OCR Text	...13 pi (epad so - 8) process umc 5v/20v 2p3m 23bv lea d frame a194fh di e attach 8006ns( wbc )/ 84 - 3j (controller ic) / 84 - 1 lmisr4 bon d wire a u &cu mol d material g630ay msl level 2 ...
Description	Plastic Encapsulated Device
File Size	79.58K / 5 Page	View it Online	Download Datasheet

				Alpha & Omega Semiconductors
Part No.	AOZ8000HI
OCR Text	...duct id aoz8000hi process umc 0.5um 5/18v 2p3m process package type sc70 die ue003a3 (size: 716 x 616 um) l/f material agcu die attach material ablebond 8006ns die bond wire au , 1mil mold material cel9220hf...
Description	Plastic Encapsulated Device
File Size	86.03K / 4 Page	View it Online	Download Datasheet

				Alpha & Omega Semiconductors
Part No.	AOZ8006FI
OCR Text	...duct id aoz8006fi process umc 0.5um 5/18v 2p3m process package type msop10 die ui001a1_epi (size: 716 x 616 um) l/f material asm a194fh die attach material ablestik 8360 epoxy die bond wire au , 1mil mold ma...
Description	Plastic Encapsulated Device
File Size	85.63K / 4 Page	View it Online	Download Datasheet

For umc Found Datasheets File :: 112 Search Time::1.547ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 |