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  70045-004 Datasheet PDF File

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    Agilent(Hewlett-Packard...
Part No. MR-0040.008
Description FAP MASTR

File Size 804.48K  /  2 Page

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HUA FENG CIRCUIT





    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CPT-18-6004
Description Temperature Compensated Amplifier 6 GHz - 18 GHz

File Size 883.58K  /  2 Page

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    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CMA-8-4004
Description Amplifier 4 GHz - 8 GHz

File Size 882.16K  /  2 Page

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    CGM-18-6004

Teledyne Technologies Incorporated
Part No. CGM-18-6004
Description Module Amplifier 6 GHz - 18 GHz

File Size 903.33K  /  2 Page

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    360-0004 360-0004-05-03-00

CAMBION Electronic Components
WEARNES CAMBION LTD
Part No. 360-0004 360-0004-05-03-00
Description Shorting Link, Non-insulated, .025 (0,64) diameter pins
INTERCONNECTION DEVICE

File Size 111.33K  /  1 Page

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    881-004R

Glenair, Inc.
Part No. 881-004R
Description Threaded Coupling

File Size 472.29K  /  2 Page

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    TELEDYNE[Teledyne Technologies Incorporated]
Part No. CMT-4-2004
Description Temperature Compensated Amplifier 2 GHz - 4 GHz

File Size 882.20K  /  2 Page

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    701-07-0045

Molex Electronics Ltd.
Part No. 701-07-0045
Description 2.54mm (.100) Pitch SL Wire-to-Wire Panel Mount Crimp Housing, Single Row, Version B, With Mounting Ears, 11 Circuits

File Size 166.85K  /  4 Page

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    701-07-0046

Molex Electronics Ltd.
Part No. 701-07-0046
Description 2.54mm (.100) Pitch SL Wire-to-Wire Panel Mount Crimp Housing, Single Row, Version B, With Mounting Ears, 12 Circuits

File Size 166.85K  /  4 Page

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    HMC-C004

Hittite Microwave Corporation
Part No. HMC-C004
Description WIDEBAND DRIVER AMPLIFIER MODULE, 10 MHz - 20 GHz

File Size 357.77K  /  6 Page

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