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  70567-0168 Datasheet PDF File

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    A-70567-0215 0015800267

Molex Electronics Ltd.
Part No. A-70567-0215 0015800267
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits

File Size 1,218.31K  /  7 Page

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HUA FENG CIRCUIT





    A-70567-0283 0015800269

Molex Electronics Ltd.
Part No. A-70567-0283 0015800269
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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    A-70567-0282 0015800249

Molex Electronics Ltd.
Part No. A-70567-0282 0015800249
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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    A-70567-0281 0015800229

Molex Electronics Ltd.
Part No. A-70567-0281 0015800229
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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    0015800683 A-70567-0100 15-80-0683

Molex Electronics Ltd.
Part No. 0015800683 A-70567-0100 15-80-0683
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 68 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    A-70567-0101 15-80-0703 0015800703

Molex Electronics Ltd.
Part No. A-70567-0101 15-80-0703 0015800703
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 70 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating,

File Size 1,218.28K  /  7 Page

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    A-70567-0344 15-80-1121 0015801121

Molex Electronics Ltd.
Part No. A-70567-0344 15-80-1121 0015801121
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.35K  /  7 Page

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    A-70567-0343 15-80-1101 0015801101

Molex Electronics Ltd.
Part No. A-70567-0343 15-80-1101 0015801101
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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    A-70567-0341 15-80-1061 0015801061

Molex Electronics Ltd.
Part No. A-70567-0341 15-80-1061 0015801061
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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    70567-0009 0015800221

Molex Electronics Ltd.
Part No. 70567-0009 0015800221
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating

File Size 1,218.41K  /  7 Page

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