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  87834-1611 Datasheet PDF File

For 87834-1611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    87834-1417 0878341417

Molex Electronics Ltd.
Part No. 87834-1417 0878341417
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, Gold (Au) Flash, Polyester Housing

File Size 104.96K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6116-11H
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87834-6041 0878346041

Molex Electronics Ltd.
Part No. 87834-6041 0878346041
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 112.73K  /  3 Page

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Amphenol Communications Solutions

Part No. 131-6116-11D
Description Paladin® 112Gb/s Backplane Connector, 6-Pair, 6 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    87834-6011 0878346011

Molex Electronics Ltd.
Part No. 87834-6011 0878346011
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 60 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.33K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021611-00040T4LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 40 contacts
Tech specs    

Official Product Page

    87834-6021 0878346021

Molex Electronics Ltd.
Part No. 87834-6021 0878346021
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.07K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021611-00006T8LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 6 contacts
Tech specs    

Official Product Page

    0878341045

Molex Electronics Ltd.
Part No. 0878341045
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Through Hole, Shrouded, Lead-free, 10 Circuits, 0.13μm (5μ) Gold (Au) Selective Plating, Black

File Size 120.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 10131319-16111G0LF
Description Minitek® Pwr 4.2 HCC, Dual Row, Vertical Through Hole Header, Gold Flash plating, Natural Color, 16 Positions, GW Compatible Nylon66, Tray Packing.
Tech specs    

Official Product Page

    87834-4043 0878344043

Molex Electronics Ltd.
Part No. 87834-4043 0878344043
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 40 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, without PCB Locator

File Size 93.39K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021611-00050T4LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 50 contacts
Tech specs    

Official Product Page

    87834-2441 0878342441

Molex Electronics Ltd.
Part No. 87834-2441 0878342441
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 121.31K  /  3 Page

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Amphenol Communications Solutions

Part No. 68016-113HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Single Row, 13 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    87834-4041 0878344041

Molex Electronics Ltd.
Part No. 87834-4041 0878344041
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating

File Size 113.00K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021611-00026T4LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 26 contacts
Tech specs    

Official Product Page

    87834-1411 0878341411

Molex Electronics Ltd.
Part No. 87834-1411 0878341411
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 14 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 20021611-00044T8LF
Description 1.27mm (0.05in.) pitch, Header with eject latch, 44 contacts
Tech specs    

Official Product Page

    Samsung Semiconductor Co., Ltd.
Part No. KS16116-02
Description 9600 bps FAX MODEM(9600bps传真调制解调 9600 bps的传真调制解调器9600bps的传真调制解调器

File Size 25.32K  /  3 Page

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Amphenol Communications Solutions

Part No. 54242-807161100LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 87834-1611 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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