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DS42553 ON0598 ARE1024 DS89C420 CXA16 G562JB 1500B MAX13
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For analysis Found Datasheets File :: 8740    Search Time::1.531ms    
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    NCS20074 NCS20071 NCS20072

ON Semiconductor
Part No. NCS20074 NCS20071 NCS20072
OCR Text ...nteed by testing or statistical analysis. boldface limits apply over the specified temperature range, t a = ?40 c to 125 c. (notes 6, 7) parameter symbol conditions min typ max unit input characteristics input offset voltage v os 1.3 3...
Description Rail-to-Rail Output, BW Operational Amplifier

File Size 968.59K  /  24 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TQHIP
OCR Text ...itivity Test Run (DST): * Yield analysis * Design Sensitivity to Process Variation * 14 Wafer Start; Spread of Vp and Cgs values * * * TQHiP is a fully released and qualified process Reliability Reports * TQHiP Process Qualificatio...
Description Precision, 100UA Gain Selectable Amplifier

File Size 116.18K  /  4 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TQTRX
OCR Text ...ty Test (DST) Wafer Run * Yield analysis * Design Sensitivity to Process Variation * 14 Wafer Start; Spread of Vp Values * * TQTRp Process Qualification Status TQTRp is a fully released qualified process Reliability Reports * TQTRp P...
Description Advanced Passives & MESFET Foundry Service

File Size 172.25K  /  6 Page

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    EXAR[Exar Corporation]
Part No. XRDAN30
OCR Text ...nt Circuit at Full Scale for AC analysis % %$ + $ ' & Figures 3, 4 and 5.2& 3) $ & ) ) $ ) 1 4, - -. -. - Gain (dB) Amp Main Pole P1 /01 ,(% +4 2 Figure...
Description CMOS Current Output D/A Converter Design Concepts for Wide Bandwidth Applications

File Size 126.50K  /  4 Page

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    AN610

Vishay Siliconix
Part No. AN610
OCR Text ...re used for data collection and analysis. The thermal fatigue DOE comprises 3,000 temperature cycles from 0 C to 100 C for a component sample size of 32+10 (re-work) as defined in IPC-9701. Event recording and monitoring of solder joint res...
Description PolarPAK Solder Joint Reliability Based on Thermal Fatigue IPC-9701

File Size 1,196.47K  /  17 Page

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    HT9032C HT9032D

Holtek Semiconductor In...
Holtek Semiconductor Inc
Part No. HT9032C HT9032D
OCR Text ...t involved with the ring signal analysis enabled, including RDET2 pin. With RDET2 pin enabled, a portion of the power ring above 1.2V is fed to the ring analysis circuit. Once the ring signal is qualified, the RDET pin will be sent low. ...
Description Calling Line Identification Receiver

File Size 184.87K  /  14 Page

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    INFINEON[Infineon Technologies AG]
Part No. SLE66C168PE SLE66C168PEM5 SLE66C168PEC
OCR Text ...l attacks such as: Simple Power analysis (SPA) , Differential Power analysis (DPA), Protection against Differential Fault analysis (DFA), Electromagnetic Emanation Attack (EMA) and other possible HW or SW attacks Peripherals: The CRC mod...
Description Security & Chip Card ICs

File Size 59.24K  /  8 Page

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    PT2257-SL

Princeton Technology Corp
Part No. PT2257-SL
OCR Text ... - FAST FOURIER TRANSFORM (FFT) analysis 1 (Conditions: Rload=10K, Volume Att=0dB, VCC=9V, Output Level=1Vrms) +0 -20 -40 dB -60 -80 -100 -120 -140 -160 20 50 100 200 500 Hz 1k 2k 5k 10k PT2257 THD - FAST FOURIER TRANSFORM (FFT) ...
Description Electronic Volume Controller IC

File Size 343.65K  /  20 Page

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    SLE66C161PE SLE66C161PEM5 SLE66C161PEC

INFINEON[Infineon Technologies AG]
Part No. SLE66C161PE SLE66C161PEM5 SLE66C161PEC
OCR Text ...l attacks such as: Simple Power analysis (SPA) , Differential Power analysis (DPA), Protection against Differential Fault analysis (DFA), Electromagnetic Emanation Attack (EMA) and other possible HW or SW attacks Peripherals: The CRC mod...
Description SECURITY & CHIP CARD ICS

File Size 57.95K  /  8 Page

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