bondable pdf Datasheet P11 Full Text Search --- IC-ON-LINE


	Part Number	Hot Search : DUR06A Y7C151 2SC4935Y 25HFR140 X1001 SR540 D471K SR2100
	Product Description
	Full Text Search

bondable Datasheet PDF File

For bondable Found Datasheets File :: 249 Search Time::0.937ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |

				SSDI[Solid States Devices, Inc]
Part No.	SEP0525
OCR Text	...erature Solderable Top or Wire bondable Metal Scheme Available Maximum Ratings Peak Repetitive Reverse and DC Blocking Voltage Average Rectified Forward Current (Resistive Load, 60Hz, Sine Wave, TJ = 75 oC Operating and Storage Tempera...
Description	5 AMPS 25 VOLTS SUPER SCHOTTKY RECTIFIER
File Size	40.92K / 2 Page	View it Online	Download Datasheet

				SSDI[Solid States Devices, Inc]
Part No.	SEP0125
OCR Text	...erature Solderable Top or Wire bondable Metal Scheme Available Maximum Ratings Peak Repetitive Reverse and DC Blocking Voltage Average Rectified Forward Current (Resistive Load, 60Hz, Sine Wave, TJ = 75 oC Operating and Storage Tempera...
Description	1 AMP 25 VOLTS SUPER SCHOTTKY RECTIFIER
File Size	40.45K / 2 Page	View it Online	Download Datasheet

				Intersema Sensoric SA
Part No.	MS7204-A2
OCR Text	...63 mm 2 2 WIRE BONDING The bondable area is 100 x 100 m for the EPI pad and 100 x 285 m for the other pads. The location of the bonding pads is close to the top Pyrex glass edge reducing the possible size and angle of the bonding capil...
Description	PRESSURE SENSOR DIE (0-4 BAR) FOR HARSH ENVIRONMENT
File Size	197.04K / 5 Page	View it Online	Download Datasheet

				M/A-COM Technology Solutions, Inc.
Part No.	MA4MV4
OCR Text	...s are used to provide an easily bondable metal pad on the capacitor chip. M/A-Com MNS capacitors have shown no measurable capacitance change when subjected to the rated standoff voltage at 150 Degrees C. The MA4M series of chip capacitors i...
Description	MNS Microwave Chip Capacitors
File Size	131.83K / 4 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	SC070
OCR Text	... SC070xxxxA5x SC070xxxxS5x Wire bondable Solderable -Ti 2 kA Metal Thickness Front Metal Al 30 kA Ni 1 kA -Ag 35 kA Cr 1 kA Cr 1 kA Metal Thickness Back Metal Ni 2 kA Ni 2 kA Ag 3 kA Ag 3 kA Recommended Storage Environment: Store in orig...
Description	Schottky Die 70 x 92 Mils
File Size	322.32K / 5 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	EMP30P06D
OCR Text	...ndard and well know DBC (Direct bondable Copper): over a thick Copper base an allumina (Al2O3) substrate with a 300m copper foil on both side is placed and IGBTs and Diodes dies are directly soldered, through screen printing process. These ...
Description	Programmable solated intelligent power module, a 30A, 600V, three-phase inverter for 15kW industrial and servo motors
File Size	731.97K / 16 Page	View it Online	Download Datasheet

				MICROSEMI[Microsemi Corporation]
Part No.	MXP18-C
OCR Text	...y Isolated Diodes Aluminum Wire bondable Backside Metallization - Gold Die Attach methods: Eutectic or Epoxy Electrical Characteristics @ 25oC SYMBOL VOC ISC VB CHARACTERISTIC Open Circuit Voltage Short Circuit Current Reverse Breakdown...
Description	Multi Element Opto Arrays Monolithic Photodiode Array-Chip CERM RESONATOR 6.00MHZ .5% SMD
File Size	43.29K / 1 Page	View it Online	Download Datasheet

				KOA
Part No.	RK73H1JTTD1622F RK73H1JTTDXXXXX RK73H2XXXXXXX RK73H1JTTXXXXXX
OCR Text	...lead) Also available with epoxy bondable palladium silver terminations in 1J, 2A and 2B sizes. Gold termination available for 1E and 1J sizes * Meets or exceeds EIA 575, EIAJ RC 2690A, EIA PDP-100, MIL-R-55342F * Marking: Four-digit black o...
Description	Thick Film Chip Resistor
File Size	71.96K / 2 Page	View it Online	Download Datasheet

				Intersema Sensoric SA
Part No.	MS7212-A MS7212
OCR Text	...89 mm 2 2 WIRE BONDING The bondable area is 100 x 100 m . The location of the bonding pads is close to the top Pyrex glass edge reducing the possible size and angle of the bonding capillary. Refer to the detail view D on the layout for...
Description	PRESSURE SENSOR DIE (0-12 BAR) FOR HARSH ENVIRONMENT
File Size	253.18K / 4 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKR1210
OCR Text	...s Values 12.4 x 12.4 153.76 bondable (Al) solderable (Ag/Ni) Al, diameter 500 m tray 36 Unit mm2 mm2 pcs SKR (c) by SEMIKRON Rev. 1 - 19.02.2010 1 SKR 12,4 Qu bond This is an electrostatic discharge sensitive device (E...
Description	DIODE
File Size	90.12K / 2 Page	View it Online	Download Datasheet

For bondable Found Datasheets File :: 249 Search Time::0.937ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |