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bonded-pair Datasheet PDF File

For bonded-pair Found Datasheets File :: 314 Search Time::2.891ms
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				Hittite Microwave Corporation
Part No.	HMC13507
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs MMIC BI-PHASE MODULATOR, 1.8 - 5.2 GHz
File Size	448.45K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC13607
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs MMIC BI-PHASE MODULATOR, 4 - 8 GHz
File Size	446.73K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC13707
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs MMIC BI-PHASE MODULATOR, 6 - 11 GHz
File Size	454.61K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC20307 HMC203
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs MMIC DOUBLE-BALANCED MIXER, 14 - 23 GHz
File Size	113.18K / 6 Page	View it Online	Download Datasheet

				Conexant Systems, Inc
Part No.	CX96XXX CX96629 CX96420 CX96429
OCR Text	...oice gateways VDSL2 12 MHz pair bonded voice gateway Conexant Product Portfolio Thecompany'sbroadportfolioofsemiconductorproductsalsoincludesclient-sideDSL,cable,anddial-upmodemsolutions;fiberopticsystem-onchips;broadcastvideoencodersand...
Description	Integrated VDSL2 CPE Gateway Chipsets
File Size	218.42K / 2 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-XDH158
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs MMIC X4 ACTIVE FREQUENCY MULTIPLIER, 54 - 64 GHz OUTPUT
File Size	190.21K / 6 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	EMP25Q12A EMP25Q12B EMP25Q12C EMP25Q12D EMP25Q12M EMP25P12A EMP25P12B EMP25P12C EMP25P12D EMP25P12M EMP25E12A EMP25E12B EMP25E12C EMP25E12D EMP25E12M EMP25F12A EMP25F12B EMP25F12C EMP25F12D EMP25F12M EMP25G12A EMP25G12B EMP25G12C EMP25G12D EMP25G12M
OCR Text	...ing resistor's head is directly bonded to an external pin to reduce parasitic effects and achieve high accuracy on feedback voltages. Since ...pair elements for these power transistors. Thanks to the new design and technological realization, t...
Description	Programmable solated intelligent power module, a 25A, 1200V, three-phase inverter for 15kW industrial and servo motors NPT IGBTs 25A, 1200V
File Size	1,036.38K / 15 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-MDB207
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs MMIC I/Q MIXER 55 - 64 GHz
File Size	237.64K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC-XDB112
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs MMIC PASSIVE FREQUENCY DOUBLER, 10 - 15 GHz INPUT
File Size	154.20K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC26606
OCR Text	...bonds should be thermosonically bonded with a force of 40-60 grams. DC bonds of 0.001" (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All b...
Description	GaAs MMIC SUB-HARMONICALLY PUMPED MIXER, 20 - 40 GHz
File Size	268.75K / 6 Page	View it Online	Download Datasheet

For bonded-pair Found Datasheets File :: 314 Search Time::2.891ms
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