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bonding Datasheet PDF File

For bonding Found Datasheets File :: 8467 Search Time::4.156ms
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				M/A-COM Technology Solu...
Part No.	MASW4060G-15
OCR Text	.... (from - 55c to +85c) wire bonding a. ball or wedge with 1.0 mil diameter pure gold wire. thermosonic wirebonding with a nominal stage temperature of 150c and a ball bonding force of 40 to 50 grams or wedge bonding forc...
Description	GaAs SP4T Switch DC - 4.0 GHz
File Size	504.72K / 4 Page	View it Online	Download Datasheet

				NEC[NEC]
Part No.	UPG100P UPG101P
OCR Text	... 2 3 4 5 6 1.3 bonding Pad Size: 100 m x 100 m PPG101P 10 9 8 1.0 1 7 1: 2: 3: 4: 5: 6: 7: 8: 9: 10: IN GND GND VGG GND GND OUT GND VDD GND 2 3 4 5 6 1.3 bonding Pad Size: 100 m 100 m...
Description	WIDE BAND AMPLIFIER CHIPS
File Size	97.39K / 8 Page	View it Online	Download Datasheet

				Vishay Siliconix
Part No.	MTT1100AKMAGKWS MTT1100AKMANHWS MTT1100AKMANKWS MTT1100AKMAGHWS MTT11000FCAGHWS MTT11000FCAGKWS MTT11000FCGGHWS MTT11000FCGGKWS MTT11000FCGNHWS MTT11000FCGNKWS MTT11000FKAGHWS MTT11000FKANHWS MTT11000FKGGKWS MTT11000FKGNHWS MTT11000FKGNKWS MTT11000FMAGHWS MTT11000FMANHWS MTT11000FMANKWS MTT11000FMGGKWS MTT11000FMGNKWS MTT11000GCANHWS MTT11000GCANKWS MTT11000GCGGKWS MTT11000FCANHWS MTT11000FCANKWS MTT11000FKAGKWS MTT11000FKANKWS MTT11000FKGGHWS MTT11000FMAGKWS MTT11000FMGGHWS MTT11000FMGNHWS MTT11000GCAGKWS MTT11000GCGGHWS MTT11002JMAGKWS MTT11001JMAGKWS MTT1100AJMAGKWS MTT11002JMAGHWS MTT11001JMAGHWS MTT11000JMAGHWS MTT1100AJMAGHWS
OCR Text	...esistance value is obtained by bonding the wires to the appropriate pads. these chips are manufactured using vishay electro-films (efi) sophisticated thin film equipment and manufacturing technology. the mtts are 100 % electrically tes...
Description	Wire Bondable Thin Film Multi-Tap Resistor Arrays
File Size	97.92K / 3 Page	View it Online	Download Datasheet

				Mini-Circuits
Part No.	AVA-24A-D AVA-24A-DP AVA-24A-DG AVA-24A-DF
OCR Text	...bond pad size, m 80 x 80 fig 3. bonding pad positions bonding pad position (dimensions in m, typical) fig 2. die layout 0 5 10 15 20 25 30 35 40 45 4000 9000 14000 19000 24000 oip3 - minimum (dbm) freq (mhz) -5dbm -3dbm 0dbm 3dbm 5dbm 6db...
Description	Monolithic Amplifier Die
File Size	255.83K / 6 Page	View it Online	Download Datasheet

				Mini-Circuits
Part No.	AVA-183A-DP AVA-183A-DG
OCR Text	...bond pad size, m 80 x 80 fig 3. bonding pad positions bonding pad position (dimensions in m, typical) fig 2. die layout page 1 of 1 tested with agilent pna-x model:n5242a s/n:my47200155 cal due date: 30th sept 2015 confidential 10 15 20 25...
Description	Monolithic Amplifier
File Size	276.10K / 6 Page	View it Online	Download Datasheet

				ROHM
Part No.	SLR-56YY3F SLR-56MG3F SLR-56VR3F
OCR Text	... side min.4 5 to be fixed die bonding side slr-56 series 2014.12 - rev.b 5/7 l attention points in handling visual light emitting diode does not contain reinforcement materials such as glass fillers.therefore if sudden thermal and mechani...
Description	Circular LED lamp
File Size	922.93K / 8 Page	View it Online	Download Datasheet

				United Monolithic Semic... UMS[United Monolithic Semiconductors]
Part No.	CHU2277 CHU2277-99F_00 CHU2277-99F/00
OCR Text	...the RF pads the equivalent wire bonding inductance (diameter=25m) have to be according to the following recommendation. Port IN (2) OUT1 (5) OUT2 (8) Equivalent inductance (nH) L_in = 0.32 L_out1 = 0.32 L_out2 = 0.32 Wire length (mm) (1) 0....
Description	W-band Multifunction : Multiplier / MPA
File Size	156.76K / 7 Page	View it Online	Download Datasheet

For bonding Found Datasheets File :: 8467 Search Time::4.156ms
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