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For epoxy Found Datasheets File :: 55291    Search Time::4.047ms    
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    CMG02

Toshiba Corporation
Toshiba Semiconductor
Part No. CMG02
OCR Text ...64 t) Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (soldering land: 6 mm x 6 mm) (board thickness: 1.6 t) Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (soldering land: 2.1 mm x 1.4 mm) (board thickn...
Description Zener Diode; Application: General; Pd (mW): 400; Vz (V): 10.2 to 10.6; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MHD
General Purpose Rectifier Applications

File Size 183.76K  /  4 Page

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    UC3803X UY3863X UG3803X UB3803X

STANLEY ELECTRIC CO.,LTD.
Part No. UC3803X UY3863X UG3803X UB3803X
OCR Text ... Product features : Water Clear epoxy : Pale Yellow Clear epoxy : Pale Red Clear epoxy Outer Dimension 3 Round shape type Operation temperature range. Storage Temperature :-40100 Operating Temperature :-4085 Lead-free soldering compatibl...
Description Single Color ヵ3 Flush Mount Round Shape Type

File Size 314.12K  /  24 Page

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    UC3804X UY3864X

STANLEY ELECTRIC CO.,LTD.
Part No. UC3804X UY3864X
OCR Text epoxy UY : Pale Yellow Clear epoxy UR : Pale Red Clear epoxy Outer Dimension 3 Round shape type Operation temperature range. Storage Temperature :-40100 Operating Temperature :-4085 Lead-free soldering compatible RoHS compliant Product ...
Description Single Color ヵ3 Flush Mount Round Shape Type
Single Color 楼玫3 Flush Mount Round Shape Type

File Size 329.37K  /  24 Page

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    CLS01

Toshiba Corporation
Toshiba Semiconductor
Part No. CLS01
OCR Text ...0 MHz Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (board thickness: 1.6 t) (soldering land) Cathode 5.7 mm x 6.2 mm Anode 4.5 mm x 3.4 mm Min Typ. 0.34 0.38 0.45 8.0 0.1 530 Max 0.47 1.0 A mA pF V Unit Th...
Description Switching-Mode Power Supply (Secondary-Rectification) Applications (Low Voltage)

File Size 204.69K  /  5 Page

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    BD3539FVM BD3539NUX BD3539NUX-TR

ROHM
Part No. BD3539FVM BD3539NUX BD3539NUX-TR
OCR Text ...ing a 70mm x 70mm x 1.6mm glass-epoxy substrate, with no heat sink ja=212.8c /w (note 4) for ta 25c (with no heat sink) ja=516.5c /w (note 5) for ta 25c when mounting a 70mm x 70mm x 1.6mm glass-epoxy substrate 1-layer board, ja=2...
Description Termination Regulator for DDR-SDRAMs

File Size 533.55K  /  21 Page

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    BD3533F BD3533FVM

ROHM
Part No. BD3533F BD3533FVM
OCR Text ...n a board 70mmx70mmx1.6mm glass-epoxy pcb). (note 4) reduce by 3.5mw /c for ta over 25 c (with no heat sink). (note 5) reduce by 5.04mw/ c for ta over 25 c (when mounted on a 70mmx70mmx1.6mm glass-epoxy board, 1-layer , copper foil a...
Description Termination Regulator for DDR-SDRAMs

File Size 1,187.85K  /  20 Page

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    CLS02

Toshiba Corporation
Toshiba Semiconductor
Part No. CLS02
OCR Text ...0 MHz Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (board thickness: 1.6 t) (soldering land) Cathode 5.7 mm x 6.2 mm Anode 4.5 mm x 3.4 mm Min Typ. 0.36 0.41 0.5 4.0 0.03 420 Max 0.55 1.0 A mA pF V Unit Th...
Description Switching-Mode Power Supply (Secondary-Rectification) Applications (Low Voltage)

File Size 178.76K  /  5 Page

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    CLS03

Toshiba Corporation
Toshiba Semiconductor
Part No. CLS03
OCR Text ...0 MHz Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (board thickness: 1.6 t) (soldering land) Cathode 5.7 mm x 6.2 mm Anode 4.5 mm x 3.4 mm Min Typ. 0.36 0.41 0.53 7.0 0.1 345 Max 0.58 1.0 A mA pF V Unit Th...
Description Switching-Mode Power Supply (Secondary-Rectification) Applications (Low Voltage)

File Size 204.03K  /  5 Page

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    BD6222HFP-TR

ROHM
Part No. BD6222HFP-TR
OCR Text ...n a 70mm x 70mm x 1.6mm glass - epoxy board. product structure silicon monolithic integrated circuit this product has no designed protection against radioactive rays. 1/ 21 tsz02201 - 0p2p0b300080 -1-2 09.sep.2014 rev.003...
Description 18V Max. H-bridge Drivers

File Size 1,021.17K  /  24 Page

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