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AM2520 RF1304 2810LED MBR6060R BFXXXX FEP16JTD MBR6060R UPD166
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For irons Found Datasheets File :: 430    Search Time::1.75ms    
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    HB[HB Electronic Components]
Part No. 540PG2C
OCR Text ...e the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature....
Description LED SPECIFICATION

File Size 657.07K  /  9 Page

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    HB[HB Electronic Components]
Part No. 540VG2C
OCR Text ...e the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature....
Description LED SPECIFICATION

File Size 766.76K  /  9 Page

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    HB[HB Electronic Components]
Part No. 540VW6C
OCR Text ...e the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature....
Description LED SPECIFICATION

File Size 769.44K  /  10 Page

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    HB[HB Electronic Components]
Part No. 550MW7C
OCR Text ...e the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature....
Description LED SPECIFICATION

File Size 771.80K  /  10 Page

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    HB[HB Electronic Components]
Part No. 560JY8C
OCR Text ...e the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature....
Description 5.0 mm DIA LED LAMP

File Size 408.00K  /  8 Page

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    HB[HB Electronic Components]
Part No. 560PB6C
OCR Text ...e the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature....
Description LED SPECIFICATION

File Size 752.26K  /  9 Page

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    HB[HB Electronic Components]
Part No. 560PR2C
OCR Text ...e the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature....
Description 5.0 mm DIA LED LAMP

File Size 314.35K  /  8 Page

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    HB[HB Electronic Components]
Part No. 560VW6C
OCR Text ...e the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature....
Description LED SPECIFICATION

File Size 775.80K  /  10 Page

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    HB[HB Electronic Components]
Part No. 913MR2C
OCR Text ...e the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature....
Description FLUX LED SPECIFICATION

File Size 596.46K  /  9 Page

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    HB[HB Electronic Components]
Part No. 913MW7C
OCR Text ...e the soldering conditions with irons stated above: select a best-suited method that assures the least stress to the LED. 5) Lead cutting after soldering should be performed only after the LED temperature has returned to normal temperature....
Description FLUX LED SPECIFICATION

File Size 782.45K  /  10 Page

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For irons Found Datasheets File :: 430    Search Time::1.75ms    
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