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  LTE-1650 Datasheet PDF File

For LTE-1650 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    87758-1650

Molex Electronics Ltd.
Part No. 87758-1650
Description 2.00mm (.079) Pitch Milli-Grid Header, Through Hole, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 135.76K  /  4 Page

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Rochester Electronics LLC

Part No. HM1-6504/B
Description HM1-6504 - Standard SRAM, 256X4, 300ns, CMOS
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    87759-1650

Molex Electronics Ltd.
Part No. 87759-1650
Description 2.00mm (.079) Pitch Milli-Grid Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free

File Size 174.11K  /  4 Page

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Texas Instruments

Part No. LM3209TLX/NOPB
Description LM3209 Seamless-Transition Buck-Boost Converter for LTE and HSUPA 12-DSBGA
Tech specs    

Official Product Page

    87759-1650

Molex Electronics Ltd.
Part No. 87759-1650
Description 2.00mm (.079) Pitch Milli-Grid?/a> Header, Surface Mount, Vertical, 16 Circuits, 0.38μm (30μ) Gold (Au) Selective Plating, with Press-fit Plastic Pegs, Lead-free

File Size 174.11K  /  4 Page

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Texas Instruments

Part No. LM3209TLE/NOPB
Description LM3209 Seamless-Transition Buck-Boost Converter for LTE and HSUPA 12-DSBGA
Tech specs    

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Official Product Page

    Optoway Technology, Inc.
Part No. DL-5528S-1650-FB
Description 1650 nm DFB LASER DIODE MODULES 2.5 Gbps UNCOOLED MQW DFB LD WITH RECEPTACLE 1650 nm的DFB激光器二极管模.5 Gbps的致冷与插座量子阱半导体激光器

File Size 107.14K  /  2 Page

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Texas Instruments

Part No. LM3269TLE/NOPB
Description Seamless Transition Buck/Boost Converter for LTE and HSPA RF Power Amplifiers 12-DSBGA -30 to 85
Tech specs    

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Official Product Page

    DL-5500S-1650

Optoway Technology, Inc.
Optoway Technology Inc
Part No. DL-5500S-1650
Description 1650 nm DFB LASER DIODE MODULES 2.5 Gbps UNCOOLED MQW DFB LD WITH RECEPTACLE

File Size 107.68K  /  2 Page

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Texas Instruments

Part No. LM3269TLX/NOPB
Description Seamless Transition Buck/Boost Converter for LTE and HSPA RF Power Amplifiers 12-DSBGA -30 to 85
Tech specs    

Official Product Page

    DL-5300S-1650

Optoway Technology Inc
Part No. DL-5300S-1650
Description 1650 nm DFB LASER DIODE MODULE UNCOOLED MQW DFB LD WITH PIGTAIL

File Size 88.02K  /  2 Page

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Amphenol Communications Solutions

Part No. 54121-108081650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MAXIM - Dallas Semiconductor
Part No. DS1650
Description Partitionable 4096K NV SRAM

File Size 453.31K  /  12 Page

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Amphenol Communications Solutions

Part No. 54122-109201650LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 20 position, 2.54mm (0.100in) pitch
Tech specs    

Official Product Page

    L16503

STMicroelectronics
Part No. L16503
Description 3A POWER OPERATIONAL AMPLIFIER

File Size 127.10K  /  9 Page

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Amphenol Communications Solutions

Part No. 54242-809341650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    T1650H-6G T1650H-6G-TR T1650H-6I T1650H-6T

STMicroelectronics
Part No. T1650H-6G T1650H-6G-TR T1650H-6I T1650H-6T
Description 600 V, 16 A, SNUBBERLESS TRIAC, TO-220AB
High temperature 16 A Triacs

File Size 116.82K  /  10 Page

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Amphenol Communications Solutions

Part No. 54121-109121650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    2-165012-1 2-165012-D

Tyco Electronics
Part No. 2-165012-1 2-165012-D
Description RECTANGULAR TONGUE SLOTTED

File Size 43.10K  /  1 Page

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Amphenol Communications Solutions

Part No. 54121-810121650LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 12 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

For LTE-1650 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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