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  memory-die Datasheet PDF File

For memory-die Found Datasheets File :: 6208    Search Time::1.61ms    
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    Cypress Semiconductor, Corp.
Part No. CY14B101LA-SP45XI CY14B101LA-SP45XIT CY14B101LA-BA45XI CY14B101LA-BA45XIT
OCR Text ...h a nonvolatile element in each memory cell. the memory is organized as 128 k bytes of 8 bits each or 64 k words of 16 bits each. the embedd...die. 5. address expansion for 4-mbit. nc pin not connected to die. 6. address expansion for 8-mbit. ...
Description 1 Mbit (128K x 8/64K x 16) nvSRAM; Organization: 128Kb x 8; Vcc (V): 2.7 to 3.6 V; Density: 1 Mb; Package: SSOP 128K X 8 NON-VOLATILE SRAM, 45 ns, PDSO48

File Size 845.13K  /  28 Page

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    Samsung Electronic
Part No. M464S0924BT1 M464S1724BT1SDRAMSODIMM
OCR Text ... # of bytes written into serial memory at module manufacturer 128bytes 80h 1 total # of bytes of spd memory device 256bytes (2k-bit) 08h 2 f...die (4th gen.) 43h 93 manufacturing date (week) - - 3 94 manufacturing date (year) - - 3 95~98 assem...
Description 8M x 64 SDRAM SODIMM based on 8M x 16, 4Banks, 4K Refresh, 3.3V Synchronous DRAMs with SPD Serial Presence Detect
16Mx64 SDRAM SODIMM based on 8Mx16,4Banks,4K Refresh,3.3V Synchronous DRAMs with SPD Serial Presence Detect

File Size 201.18K  /  26 Page

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    Samsung Electronic
Part No. M374S0823DTS
OCR Text ... # of bytes written into serial memory at module manufacturer 128bytes 80h 1 total # of bytes of spd memory device 256bytes (2k-bit) 08h 2 f...die (5th gen.) 44h 93 manufacturing date (week) - - 3 94 manufacturing date (year) - - 3 95~98 assem...
Description 8M x 64 SDRAM SODIMM based on 8M x 16, 4Banks, 4K Refresh, 3.3V Synchronous Synchronous DRAMs with SPD Data Sheet

File Size 55.83K  /  7 Page

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    Cypress Semiconductor, Corp.
CYPRESS SEMICONDUCTOR CORP
Part No. CY14B104L-BA15XCT CY14B104L-BA15XI
OCR Text ... a nonvolatile element in each memory cell. the memory is organized as 512k words of 8 bits each or 256k words of 16 bits each. the embedde...die. 3. address expansion for 16 mbit. nc pin not connected to die. v ss dq6 dq5 dq4 v cc a 13 dq3 a...
Description 4 Mbit (512K x 8/256K x 16) nvSRAM 512K X 8 NON-VOLATILE SRAM, 15 ns, PBGA48

File Size 501.55K  /  23 Page

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    Freescale Semiconductor
Part No. MM912F634
OCR Text ...e bus interface for transparent memory mapping ? on-chip oscillator & two independent watchdogs ? lin 2.1 physical layer interface with inte...die differences between the derivatives. see section 4.2.3, ?analog die options" for detailed info...
Description Integrated S12 Based Relay Driver

File Size 2,315.80K  /  335 Page

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    Motorola
Part No. MPC8245ARZUPNS
OCR Text ...dd ?0.3 to 2.2 v supply voltage?memory bus drivers gv dd ?0.3 to 3.6 v supply voltage?pci and standard i/o buffers ov dd ?0.3 to 3.6 v suppl...die-junction temperature range t j 0 to 105 c storage temperature range t stg ?55 to 150 c notes: 1....
Description MPC8245 Part Number Specification for the MPC8245ARZUnnnX Series

File Size 263.63K  /  12 Page

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    飞思卡尔半导体(中国)有限公司
Part No. MPC8245ARZU466D MPC8245ARZU400D MPC8245RZU400D
OCR Text ...dd ?0.3 to 2.2 v supply voltage?memory bus drivers gv dd ?0.3 to 3.6 v supply voltage?pci and standard i/o buffers ov dd ?0.3 to 3.6 v suppl...die-junction temperature range t j 0 to 85 c storage temperature range t stg ?55 to 150 c notes: 1. ...
Description Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT00; Number of Contacts:19; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle
Circular Connector; Body Material:Aluminum; Series:PT00; Number of Contacts:19; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle; Circular Contact Gender:Pin
Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT00; No. of Contacts:19; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Wall Mount Receptacle; Gender:Male
Part Number Specification for the MPC8245ARZUnnnX Series 型号规格MPC8245ARZUnnnX系列

File Size 91.20K  /  20 Page

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    Microchip
Part No. MCRF355 MCRF360
OCR Text ...ing protocol  154 bits of user memory  on-board 100 ms sleep timer  built-in anti-collision algorithm for reading up to multiple tags i...die, wafer, bumped wafer, cob, pdip or soic package options application  book store and library bo...
Description The MCRF355 is a uniquely designed read-only passive Radio Frequency Identification (RFID) IC device with advanced anticollision features optimized at 13.56 MHz. The device is powered remotely by rectifying RF magnetic fields that are tran
The MCRF360 is a uniquely designed read-only passive Radio Frequency Identification (RFID) IC device with advanced anticollision features operating at 13.56 MHz. The device is powered remotely by rectifying RF magnetic fields that are tran

File Size 560.52K  /  22 Page

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For memory-die Found Datasheets File :: 6208    Search Time::1.61ms    
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