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2N657 16LT1 F4004 22210 F4004 MC144 94RB44 UHN1C
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For merged Found Datasheets File :: 974    Search Time::1.016ms    
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    AMSCO[austriamicrosystems AG]
Part No. AS1977 AS1976
OCR Text ...may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. All products and companies mentioned are trademarks or registered trademarks of their respective companies. Dis...
Description Ultra-Low Current, 1.8V Comparators

File Size 135.21K  /  2 Page

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    AMSCO[austriamicrosystems AG]
Part No. AS3517
OCR Text ...may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. All products and companies mentioned are trademarks of their respective companies. Disclaimer Devices sold by ...
Description Stereo Audio Codec with advanced System Power Management

File Size 222.84K  /  3 Page

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    ATMEL[ATMEL Corporation]
Part No. ATA5282
OCR Text ...pin outputs the demodulated and merged signal of the 3 input stages. To achieve data rates up to 4 kbps for input signals from 2.8 mVPP to 3.1 VPP it is necessary to control the gain of the amplifiers. Each of the 3 input stages contain an ...
Description ULTRA LOW POWER 125 KHZ 3D WAKE UP RECEIVER WITH RSSI

File Size 358.73K  /  23 Page

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    STMICROELECTRONICS[STMicroelectronics]
Part No. ESDAXXXP6 ESDA14V2BP6 ESDA6V1-5P6 ESDA6V1P6
OCR Text ...5P6 and ESDA14V2BP6: datasheets merged. ECOPACK statement added. Some curves combined. Reformatted to current standards. Modified package information to show both SOT-666 and SOT-666IP. 7/8 ESDAxxxP6 Please Read Carefully: Infor...
Description Transil array for ESD protection
Transil⑩ array for ESD protection

File Size 89.93K  /  8 Page

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    INFINEON[Infineon Technologies AG]
Part No. HYE18L128160BF-75 HYB18L128160BC-75 HYB18L128160BF HYB18L128160BF-75 HYE18L128160BC-75
OCR Text ...s for half drive and full drive merged V1.3 (Preliminary Datasheet) 2004-03-19 power-up sequence: 2 instead of 8 ARF commands required Table 22: IDD6 specification modified: typ. and max. values given V1.2 (Preliminary Datasheet) V1.1 (Prel...
Description DRAMs for Mobile Applications

File Size 1,052.01K  /  53 Page

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    SAMSUNG[Samsung semiconductor]
Part No. K4N51163QC-ZC36 K4N51163QC-ZC K4N51163QC-ZC25 K4N51163QC-ZC2A K4N51163QC-ZC33
OCR Text ...ent values. - Corrected typo. - merged Device operation and timing diagram according to customer request 1.3 1.4 1.5 Jun September October 2005 2005 2005 -2- Rev 1.5 Oct. 2005 K4N51163QC-ZC 8M x 16Bit x 4 Banks graphic DD...
Description 512Mbit gDDR2 SDRAM

File Size 1,403.46K  /  64 Page

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    AMSCO[austriamicrosystems AG]
Part No. AS1915 AS1910 AS1911 AS1912 AS1913 AS1914
OCR Text ...may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. All products and companies mentioned are trademarks or registered trademarks of their respective companies. Dis...
Description Dual-Voltage Microprocessor Supervisory Circuits with Reset and Watchdog

File Size 139.58K  /  2 Page

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    AMSCO[austriamicrosystems AG]
Part No. AS1746
OCR Text ...may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. All products and companies mentioned are trademarks or registered trademarks of their respective companies. Dis...
Description 0.5/0.6ohm, Low-Voltage, Dual SPDT Analog Switch

File Size 141.63K  /  2 Page

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    OKI[OKI electronic componets]
Part No. KGL4201
OCR Text ...y four, then the two groups are merged into a single data stream using the master 10-Gbps clock. Complementary 1/8 synchronous clock outputs are made available from the KGL4201 for use in synchronizing lower frequency logic. All signal inte...
Description 10-Gbps GaAs Family High-Speed Optical Communications System

File Size 296.16K  /  24 Page

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    OKI electronic components
OKI[OKI electronic componets]
Part No. MG65P MG63P MG64P
OCR Text ... SDRAM and ASIC technology. The merged DRAM/ASIC process efficiently implements the Oki stacked capacitor memory cell. The MG63P/64P/65P CSA series uses three, four, and five metal process layers, respectively, on 0.25 m drawn (0.18 m L-eff...
Description 0.25m Embedded DRAM/ Customer Structured Arrays
0.25レm Embedded DRAM/ Customer Structured Arrays

File Size 125.78K  /  22 Page

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