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  MJR28N2NNA0-G300 Datasheet PDF File

For MJR28N2NNA0-G300 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    MMG3002NT112

Freescale Semiconductor, Inc
Part No. MMG3002NT112
Description Heterojunction Bipolar Transistor

File Size 551.79K  /  16 Page

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Rochester Electronics LLC

Part No. DG300A/BIA
Description DG300A - SPST, 2 Func, CMOS - Dual marked (M38510/11601BIA)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    MG300Q2YS60A

TOSHIBA[Toshiba Semiconductor]
Part No. MG300Q2YS60A
Description GTR Module Silicon N Channel IGBT High Power Switching Applications Motor Control Applications
From old datasheet system

File Size 187.36K  /  9 Page

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Rochester Electronics LLC

Part No. DG300A/BCA
Description DG300A - SPST, 2 Func, CMOS - Dual marked (M38510/11601BCA)
Tech specs    

Official Product Page

    MMG3001NT112

Freescale Semiconductor, Inc
Part No. MMG3001NT112
Description Heterojunction Bipolar Transistor

File Size 453.75K  /  15 Page

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Amphenol Communications Solutions

Part No. 54202-G3003ALF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MMG3002NT1 MMG3002NT108

Freescale Semiconductor, Inc
Part No. MMG3002NT1 MMG3002NT108
Description Heterojunction Bipolar Transistor Technology (InGaP HBT)

File Size 330.00K  /  16 Page

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Amphenol Communications Solutions

Part No. 54101-G30-00
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 0 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    MMG3003NT1 MMG3003NT108

Freescale Semiconductor, Inc
Part No. MMG3003NT1 MMG3003NT108
Description Heterojunction Bipolar Transistor Technology (InGaP HBT)

File Size 399.87K  /  18 Page

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Amphenol Communications Solutions

Part No. 54102-G3007B03LF
Description BERGSTIK 0.100\\ HEADER-ALTERNATE 77313-122-14LF
Tech specs    

Official Product Page

    FMG2G300US60

Fairchild Semiconductor
Part No. FMG2G300US60
Description 600V, 300A IGBT Module (Molding Type)
Molding Type Module

File Size 549.85K  /  7 Page

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Amphenol Communications Solutions

Part No. 59112-G30-05-050
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions.
Tech specs    

Official Product Page

    MG300Q2YS60A

Mitsubishi Electric Semiconductor
Part No. MG300Q2YS60A
Description High Power Switching Applications Motor Control Applications

File Size 214.82K  /  8 Page

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Amphenol Communications Solutions

Part No. 59132-G30-05-071LF
Description Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 10 Positions, 2.00mm (0.079in) Pitch
Tech specs    

Official Product Page

    MMG3004NT1 MMG3004NT108

Freescale Semiconductor, Inc
Part No. MMG3004NT1 MMG3004NT108
Description Heterojunction Bipolar Transistor Technology (InGaP HBT)

File Size 377.97K  /  21 Page

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Amphenol Communications Solutions

Part No. 54202-G3009PLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MG300Q2YS65H

Toshiba Semiconductor
Toshiba Corporation
Part No. MG300Q2YS65H
Description 300 A, 1200 V, N-CHANNEL IGBT
IGBT Module Silicon N Channel IGBT High Power & High Speed Switching Applications
TOSHIBA IGBT Module Silicon N Channel IGBT

File Size 156.72K  /  6 Page

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Amphenol Communications Solutions

Part No. 54202-G3007ALF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 14 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MMG3005NT1 MMG3005NT108

Freescale Semiconductor, Inc
Part No. MMG3005NT1 MMG3005NT108
Description Heterojunction Bipolar Transistor Technology (InGaP HBT)

File Size 363.46K  /  20 Page

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Amphenol Communications Solutions

Part No. 54202-G3009LF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 18 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For MJR28N2NNA0-G300 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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