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KODENSHI KOREA
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Part No. |
KK74AC21
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OCR Text |
... soic package+ 750 500 mw tst g st orage tem p erat ure -65 t o +150 c t l lead tem p erat ure, 1 m m from c a se for 10 seconds (plastic dip or soic package) 260 c * m a xi m u m r a t i ngs ar... |
Description |
Dual 4-Input AND Gate High-Speed Silicon-Gate CMOS
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File Size |
178.87K /
5 Page |
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MICROSEMI CORP-LAWRENCE
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Part No. |
DR5101
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OCR Text |
...dless hermetically sealed glass package ? oxide and nitride passivation for long-term stable device performance ? metallurgically bonded double plug construction ? available for upscreen to mil-prf-19500 requirements ? p... |
Description |
SILICON, SIGNAL DIODE, DO-35
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File Size |
91.48K /
2 Page |
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it Online |
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Cree
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Part No. |
C3D10065I
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OCR Text |
package provides 2.5kv isolation ? zero reverse recovery current ? high-frequency operation ? temperature-independent switching behavior ? positive temperature coeffcient on v f benefts ? electrically isolated package ? ess... |
Description |
Silicon Carbide Schottky Diode
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File Size |
422.29K /
6 Page |
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it Online |
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Kemet Corporation
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Part No. |
C0402C330K3GACTU
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OCR Text |
....3 min packaging specifications package kind: t&r package size: 7in package type: paper tape package quantity: 10000 general information supplier: kemet part type description: smd, mlcc, ultra-stable, low loss, class i specifications capaci... |
Description |
Capacitor, Ceramic, SMD, MLCC, Ultra-Stable, Low Loss, Class I, 33 pF, /-10% Tol, 25V, C0G, 0402 (1005 metric)
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File Size |
64.27K /
1 Page |
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it Online |
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Price and Availability
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