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Molex Electronics Ltd.
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Part No. |
70567-0011 A-70567-0011 0015800261
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, Tin (Sn) Plating
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File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
70567-0010 A-70567-0010 0015800241
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating
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File Size |
1,218.42K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
15-80-0129 0015800129 A-70567-0276
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla Molex Electronics Ltd.
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File Size |
1,218.57K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
0015800169 15-80-0169 A-70567-0278
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Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
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File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
0015800381 70567-0017 15-80-0381
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating
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File Size |
1,218.40K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
0015800165 15-80-0165 70567-0142 A-70567-0142
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Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,
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File Size |
1,218.25K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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Part No. |
0015800147 15-80-0147 A-70567-0209
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Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
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File Size |
1,218.31K /
7 Page |
View
it Online |
Download Datasheet |
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