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  200us Datasheet PDF File

For 200us Found Datasheets File :: 703    Search Time::4.828ms    
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    TM Technology, Inc.
TMT[Taiwan Memory Technology]
Part No. T221160A-35S T221160A-30J T221160A T221160A-30S T221160A-35J
OCR Text ... Notes: 1. An initial pause of 200us is required after power-up followed by eight RAS refresh cycles ( RAS only or CBR) before proper device operation is assured. The eight RAS cycle wake-ups should be repeated any time the tREF refresh re...
Description 64K x 16 DYNAMIC RAM FAST PAGE MODE 64K的16动态RAM快速页面模

File Size 131.74K  /  14 Page

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    KMM53216004CKG KMM53216004CK

Samsung semiconductor
Part No. KMM53216004CKG KMM53216004CK
OCR Text ... NOTES 1. An initial pause of 200us is required after power-up followed by any 8 RAS-only or CAS-before-RAS refresh cycles before proper device operation is achieved. 2. Input voltage levels are Vih/Vil. VIH(min) and VIL(max) are referenc...
Description
File Size 435.30K  /  21 Page

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    KMM5322104CKUG KMM5322104CKU

Samsung semiconductor
Part No. KMM5322104CKUG KMM5322104CKU
OCR Text ... NOTES 1. An initial pause of 200us is required after power-up followed by any 8 RAS-only or CAS-before-RAS refresh cycles before proper device operation is achieved. 2. VIH(min) and VIL(max) are reference levels for measuring timing of i...
Description 2M x 32 DRAM SIMM using 2Mx8 , 2K Refresh, 5V

File Size 265.96K  /  15 Page

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    KMM5322204C2WG KMM5322204C2W

Samsung Semiconductor Co., Ltd.
SAMSUNG[Samsung semiconductor]
Part No. KMM5322204C2WG KMM5322204C2W
OCR Text ... NOTES 1. An initial pause of 200us is required after power-up followed by any 8 RAS-only or CAS-before-RAS refresh cycles before proper device operation is achieved. 2. VIH(min) and VIL(max) are reference levels for measuring timing of i...
Description 2M x 32 DRAM SIMM using 1Mx16 , 1K Refresh, 5V 200万32的DRAM上海药物研究所使用1Mx16,每1000刷新V

File Size 278.83K  /  17 Page

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    KMM53232000BK KMM53232000BKG

Samsung semiconductor
Part No. KMM53232000BK KMM53232000BKG
OCR Text ... NOTES 1. An initial pause of 200us is required after power-up followed by any 8 RAS-only or CAS-before-RAS refresh cycles before proper device operation is achieved. 2. Input voltage levels are Vih/Vil. VIH(min) and VIL(max) are referenc...
Description
File Size 367.57K  /  18 Page

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    KMM53232000CK KMM53232000CKG

Samsung semiconductor
Part No. KMM53232000CK KMM53232000CKG
OCR Text ... NOTES 1. An initial pause of 200us is required after power-up followed by any 8 RAS-only or CAS-before-RAS refresh cycles before proper device operation is achieved. 2. Input voltage levels are Vih/Vil. VIH(min) and VIL(max) are referenc...
Description
File Size 402.45K  /  20 Page

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    KMM53232004BK KMM53232004BKG

Samsung semiconductor
Part No. KMM53232004BK KMM53232004BKG
OCR Text ... NOTES 1. An initial pause of 200us is required after power-up followed by any 8 RAS-only or CAS-before-RAS refresh cycles before proper device operation is achieved. 2. Input voltage levels are Vih/Vil. VIH(min) and VIL(max) are referenc...
Description
File Size 411.88K  /  19 Page

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    KMM53232004CK KMM53232004CKG

Samsung semiconductor
Part No. KMM53232004CK KMM53232004CKG
OCR Text ... NOTES 1. An initial pause of 200us is required after power-up followed by any 8 RAS-only or CAS-before-RAS refresh cycles before proper device operation is achieved. 2. Input voltage levels are Vih/Vil. VIH(min) and VIL(max) are referenc...
Description
File Size 449.29K  /  21 Page

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    KMM5324000BSWG KMM5328000BSW KMM5324000BSW

SAMSUNG[Samsung semiconductor]
Part No. KMM5324000BSWG KMM5328000BSW KMM5324000BSW
OCR Text ... NOTES 1. An initial pause of 200us is required after power-up followed by any 8 RAS-only or CAS-before-RAS refresh cycles before proper device operation is achieved. 2. Input voltage levels are Vih/Vil. VIH(min) and VIL(max) are referenc...
Description 4M x 32 DRAM SIMM Using 4Mx16, 4K Refresh, 5V

File Size 348.88K  /  18 Page

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    K4D551638D K4D551638D-TC K4D551638D-TC2A K4D551638D-TC33 K4D551638D-TC50 K4D551638D-TC36 K4D551638D-TC40 K4D551638D-TC45

Samsung Electronic
SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K4D551638D K4D551638D-TC K4D551638D-TC2A K4D551638D-TC33 K4D551638D-TC50 K4D551638D-TC36 K4D551638D-TC40 K4D551638D-TC45 K4D551638D-TC60
OCR Text ...in stable condition for minimum 200us. 3. The minimum of 200us after stable power and clock(CK,CK ), apply NOP and take CKE to be high . 4. Issue precharge command for all banks of the device. 5. Issue a EMRS command to enable DLL *1 6. Iss...
Description 256Mbit GDDR SDRAM 56Mbit GDDR SDRAM内存
CABLE ASSEMBLY; 2.9mm MALE TO 2.9mm MALE; 40 GHz CABLE 56Mbit GDDR SDRAM内存

File Size 228.34K  /  18 Page

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For 200us Found Datasheets File :: 703    Search Time::4.828ms    
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