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  401-2808 Datasheet PDF File

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    HSMS-2800 HSMS-2802 HSMS-2803 HSMS-2804 HSMS-280C HSMS-280E HSMS-280F HSMS-280K HSMS-280L HSMS-280M HSMS-2805 HSMS-2807

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Agilent(Hewlett-Packard)
Agilent (Hewlett-Packard)
Part No. HSMS-2800 HSMS-2802 HSMS-2803 HSMS-2804 HSMS-280C HSMS-280E HSMS-280F HSMS-280K HSMS-280L HSMS-280M HSMS-2805 HSMS-2807 HSMS-2808 HSMS-280B HSMS-280N HSMS-280P HSMS-280R HSMS-280X
Description SURFACE MOUNT RF SCHOTTKY BARRIER DIODES
HSMS-2802 · Low reverse leakage Schottky diode
HSMS-2803 · Low reverse leakage Schottky diode
HSMS-2804 · Low reverse leakage Schottky diode
HSMS-2805 · Low reverse leakage Schottky diode
HSMS-2808 · Low reverse leakage Schottky diode
HSMS-280B · Low reverse leakage Schottky diode
HSMS-280C · Low reverse leakage Schottky diode
HSMS-280E · Low reverse leakage Schottky diode
HSMS-280F · Low reverse leakage Schottky diode
HSMS-280K · Low reverse leakage Schottky diode
HSMS-280L · Low reverse leakage Schottky diode
HSMS-280M · Low reverse leakage Schottky diode
HSMS-280N · Low reverse leakage Schottky diode
HSMS-280R · Low reverse leakage Schottky diode
File Size 131.25K  /  10 Page

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Amphenol Communications Solutions
Part No. 54242-808081200LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Surface Mount, Double Row, 8 Positions
Tech specs 　 　

Official Product Page

HUA FENG CIRCUIT





    K4S280832A K4S280832A-TC_L10 K4S280832A-TC_L80 K4S280832A-TC_L1H K4S280832A-TC_L1L K4S280832A-TC_L75 K4S280832A-TC/L10 K

SAMSUNG SEMICONDUCTOR CO. LTD.
SAMSUNG[Samsung semiconductor]
Samsung Electronic
Part No. K4S280832A K4S280832A-TC_L10 K4S280832A-TC_L80 K4S280832A-TC_L1H K4S280832A-TC_L1L K4S280832A-TC_L75 K4S280832A-TC/L10 K4S280832A-TC/L1H K4S280832A-TC/L1L K4S280832A-TC/L75 K4S280832A-TC/L80
Description 128Mbit SDRAM 4M x 8Bit x 4 Banks Synchronous DRAM LVTTL
File Size 107.61K  /  10 Page

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Amphenol Communications Solutions
Part No. 54242-808081350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 8 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

   
Part No. K4H280838C-TCB3 K4H280838C-TLB0
Description 16M X 8 DDR DRAM, 0.7 ns, PDSO66
16M X 8 DDR DRAM, 0.75 ns, PDSO66
File Size 344.67K  /  54 Page

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Amphenol Communications Solutions
Part No. 77315-128-08LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Samsung Semiconductor Co., Ltd.
Part No. K9F2808U0M-YIB0 K9F2808U0M-YCB0
Description 16M x 8 Bit NAND Flash Memory 1,600 × 8位NAND闪存
File Size 349.99K  /  26 Page

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Amphenol Communications Solutions
Part No. 54122-808100950LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 10 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

    ASE02808MR-LW150-R

Projects Unlimited, Inc.
Part No. ASE02808MR-LW150-R
Description RELEASED FROM ENGINEERING
File Size 265.34K  /  1 Page

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Amphenol Communications Solutions
Part No. 54122-808641400LF
Description BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 64 position, 2.54mm (0.100in) pitch
Tech specs 　 　

Official Product Page

   
Part No. K9F2808U0C-DIB0 K9F2808U0C-YCB0
Description 16M X 8 FLASH 2.7V PROM, PBGA63
16M X 8 FLASH 2.7V PROM, 30 ns, PDSO48
File Size 798.66K  /  33 Page

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Amphenol Communications Solutions
Part No. 59202-F28-08U050
Description Minitek® 2.00mm, Board To Board, Unshrouded Vertical Header, Surface Mount, Double Row, 16 Positions.
Tech specs 　 　

Official Product Page

    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K9F2808U0A-YCB0 K9F2808U0A-YIB0
Description Circular Connector; MIL SPEC:MIL-DTL-38999 Series III; Body Material:Metal; Series:TVPS00; No. of Contacts:11; Connector Shell Size:21; Connecting Termination:Crimp; Circular Shell Style:Wall Mount Receptacle; Body Style:Straight
TV 79C 79#22D PIN RECP
File Size 356.97K  /  26 Page

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Amphenol Communications Solutions
Part No. 59132-T28-08-037LF
Description Minitek® 2.00mm, Board to Board Connector, Unshrouded Vertical Stacking Header, Through Hole, Double Row, 16 Positions, 2.00mm (0.079in) Pitch
Tech specs 　 　

Official Product Page

   
Part No. K9F2808U0B-YIB00
Description 16M X 8 FLASH 2.7V PROM, 35 ns, PDSO48
File Size 510.77K  /  30 Page

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Amphenol Communications Solutions
Part No. 54112-808260900LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    K9F2808U0 K9F2808U0A K9F2808U0A- K9F2808U0A-YCB0 K9F2808U0A-YIB0

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K9F2808U0 K9F2808U0A K9F2808U0A- K9F2808U0A-YCB0 K9F2808U0A-YIB0
Description 16M x 8 Bit NAND Flash Memory
File Size 351.20K  /  26 Page

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Amphenol Communications Solutions
Part No. 54242-808280950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 28 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

    K9F2808U0M- K9F2808U0M-YCB0 K9F2808U0M-YIB0

Samsung Electronic
SAMSUNG[Samsung semiconductor]
Part No. K9F2808U0M- K9F2808U0M-YCB0 K9F2808U0M-YIB0
Description 16M x 8 Bit NAND Flash Memory
File Size 344.24K  /  26 Page

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Amphenol Communications Solutions
Part No. 54242-808301350LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 30 Positions, 2.54mm (0.100in) Pitch.
Tech specs 　 　

Official Product Page

For 401-2808 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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