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Texas Instruments |
Part No. |
8301901EA
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Description |
Hex D-type Flip-Flops With Clear 16-CDIP -55 to 125
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Tech specs |
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Official Product Page
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Texas Instruments |
Part No. |
83019012A
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Description |
Hex D-type Flip-Flops With Clear 20-LCCC -55 to 125
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Tech specs |
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Official Product Page
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Texas Instruments |
Part No. |
8301902EA
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Description |
Quadruple D-type Flip-Flops With Clear 16-CDIP -55 to 125
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Tech specs |
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Official Product Page
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Texas Instruments |
Part No. |
8301901FA
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Description |
Hex D-type Flip-Flops With Clear 16-CFP -55 to 125
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114830-11114LF
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Description |
1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 14 Positions
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114830-11107LF
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Description |
1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 7 Positions
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114830-10103LF
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Description |
1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 3 Positions
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114830-10102LF
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Description |
1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 2 Positions
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
10114830-11115LF
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Description |
1.25mm Wire to Board Wafer, Right Angle, Surface Mount, 15 Positions
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
68583-011LF
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Description |
BergStik® 2.54mm, Board to Board connector, Vertical 2 Row Board-to-Board Stacking Header 30 Positions, 2.54mm Pitch. 0.76um (30u\\.) GXT™ Mating plating.
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Tech specs |
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Official Product Page
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Price and Availability
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