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  90130-1314 Datasheet PDF File

For 90130-1314 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

    0901301320

Molex Electronics Ltd.
Part No. 0901301320
Description
File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-4114-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Open Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901301318 90130-1318

Molex Electronics Ltd.
http://
Part No. 0901301318 90130-1318
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Vertical, Shrouded, Fully Loaded, 18 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.97K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-4416-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0901301316 90130-1316

Molex Electronics Ltd.
http://
Part No. 0901301316 90130-1316
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Vertical, Shrouded, Fully Loaded, 16 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.96K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-4118-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Open Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0901301312 90130-1312

Molex Electronics Ltd.
http://
Part No. 0901301312 90130-1312
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Vertical, Shrouded, Fully Loaded, 12 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.97K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-4514-11H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Left Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    0901301310 90130-1310

Molex Electronics Ltd.
http://
Part No. 0901301310 90130-1310
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 585.96K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-4216-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Double End Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0901303130

Molex Electronics Ltd.
Part No. 0901303130
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 30 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 168.60K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4518-21D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Left Polarized, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    0901301350

Molex Electronics Ltd.
Part No. 0901301350
Description
File Size 168.45K  /  4 Page

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Amphenol Communications Solutions

Part No. 131-4314-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 4 Column, Left End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    0901301130 90130-1130

Molex Electronics Ltd.
Part No. 0901301130 90130-1130
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 30 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 131-4616-21H
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Right Polarized, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

    EIA1314-4P EIB1314-4P

Excelics Semiconductor, Inc.
Part No. EIA1314-4P EIB1314-4P
Description 13.75-14.5GHz, 4W Internally Matched Power FET

File Size 41.89K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-4316-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 6 Column, Left End Wall, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    EIB1314-2P EIA1314-2P

Excelics Semiconductor, Inc.
Part No. EIB1314-2P EIA1314-2P
Description 13.75-14.5GHz, 2W Internally Matched Power FET

File Size 41.80K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-4618-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

For 90130-1314 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |   

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