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bondable Datasheet PDF File

For bondable Found Datasheets File :: 257 Search Time::1.407ms
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				Agilent(Hewlett-Packard)
Part No.	HSMS-0005 HSMS-0006
OCR Text	bondable ? gold metallization ? silicon nitride passivation ? uniform electrical characteristics ? batch matched versions available ? planar construction ? available in many electrical selections ? ideal for hybrid integrated circuits hsms-...
Description	Schottky Barrier Chips for Hybrid Integrated Circuits(混合集成电路应用的肖特基势垒二极
File Size	32.02K / 4 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKT5
OCR Text	...rable (ag/ni) gate and cathode bondable (al) wire bond al,diameter 500m package tray chips / package 144 pcs skt 5,6 qu rg bond. 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrostatic discharge sensitive device (esds), interna...
Description	THYRISTOR
File Size	65.33K / 2 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKCD31C060I310
OCR Text	...m 2 area total 31.36 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 314 (5" wafer) pcs skcd 31 c 060 i3 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrostati...
Description	CAL-DIODE
File Size	94.39K / 2 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKCD31C120I310
OCR Text	...m 2 area total 31.36 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 314 (5" wafer) pcs skcd 31 c 120 i3 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrostati...
Description	CAL-DIODE
File Size	94.76K / 2 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKCD31C120IHD10
OCR Text	...m 2 area total 31.36 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 314 (5" wafer) pcs skcd 31 c 120 i hd 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrosta...
Description	CAL-DIODE
File Size	94.81K / 2 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IR340LM
OCR Text	...ls 3 - type of device: l = wire bondable fast recovery diode 4 - passivation process: m = glassivated moat 5 - voltage code: code x 100 = v rrm 6 - metallization: c = aluminium (anode) - silver (cathode) 7 -t rr code: s05 = 500 nsec 8 - c...
Description	Fast Recovery Diodes
File Size	60.51K / 3 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKCD121C120I310
OCR Text	... mm 2 area total 121 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 76 (5" wafer) pcs skcd 121 c 120 i3 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrostati...
Description	CAL-DIODE
File Size	83.56K / 2 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKCD61C120I310
OCR Text	...m 2 area total 60.84 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 156 (5" wafer) pcs skcd 61 c 120 i3 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrostati...
Description	CAL-DIODE
File Size	117.79K / 2 Page	View it Online	Download Datasheet

				Semikron International
Part No.	SKCD81C120I310
OCR Text	...9 mm 2 area total 81 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 116 (5" wafer) pcs skcd 81 c 120 i3 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrostati...
Description	CAL-DIODE
File Size	91.82K / 2 Page	View it Online	Download Datasheet

For bondable Found Datasheets File :: 257 Search Time::1.407ms
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | <12> | 13 | 14 | 15 |