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ONSEMI
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| Part No. |
NLAS4685
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| OCR Text |
... is available in a 2.0 x 1.5 mm bumped die array, with a 3 x 4 arrangement of solder bumps. The pitch of the solder bumps is 0.5 mm for easy handling.
Features http://onsemi.com MARKING DIAGRAM
A1 Microbump-10 CASE 489AA A1
XXD
* ... |
| Description |
Ultra-Low Resistance Dual SPDT Analog Switch
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| File Size |
77.60K /
10 Page |
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it Online |
Download Datasheet
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Samsung Electronic
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| Part No. |
KS0718
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| OCR Text |
...up flow on page 48 to 51 Change bumped PAD size (modify figure 2 and table 1 on page 3) Change the PAD Center Coordinates of COM39 and COMS1. (modify table 2 on page 4) Change LCD power supply voltage (modify VOUT and V0 voltage on page1, 5... |
| Description |
81 COM / 104 SEG DRIVER & CONTROLLER FOR STN LCD
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| File Size |
724.28K /
66 Page |
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it Online |
Download Datasheet |
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HITACHI[Hitachi Semiconductor]
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| Part No. |
HCD667A66RBP HD667B66R HCD667B66RBP HD66766R HD667A66R
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| OCR Text |
...67B66RBP External Dimensions Au-bumped chip straight bump Au-bumped chip laced bump
Difference between HCD667x66R and HCD667x66
Table 1 Difference Pad arrangement HCD667x66R Pad No. Pad Name 63 Vcc 63 Vcc 64 Vcc 66 Vcc 67 AVcc 68 AVcc 6... |
| Description |
132 X 176-DOT GRAPHICS LCD CONTROLLER/DRIVER FOR 65K COLORS
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| File Size |
665.13K /
97 Page |
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it Online |
Download Datasheet |
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NXP Semiconductors N.V.
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| Part No. |
SL2S2102FUD SL2S2102FTB SL2S2002 SL2S2002FTB SL2S2002FUD
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| OCR Text |
...r wafer XSON3 Description sawn, bumped wafer, 120 m, on film frame carrier, Ci between LA and LB = 23.5 pF (typical) sawn, bumped wafer, 120 m, on film frame carrier, Ci between LA and LB = 97 pF (typical) Version Type number
plastic ext... |
| Description |
ICODE SLIX a product family of smart label ICs
ICODE SLIX SPECIALTY TELECOM CIRCUIT, PDSO3
ICODE SLIX SPECIALTY TELECOM CIRCUIT, UUC
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| File Size |
87.48K /
13 Page |
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it Online |
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ONSEMI[ON Semiconductor]
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| Part No. |
NLAS4684MNR2G NLAS4684MNR2 NLAS4684FCT1G
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| OCR Text |
... is available in a 2.0 x 1.5 mm bumped die array. The pitch of the solder bumps is 0.5 mm for easy handling.
Features
A1 Microbump-10 CASE 489AA A1
http://onsemi.com MARKING DIAGRAMS
* Ultra-Low RON, t0.5 W at 2.7 V * Threshold Adju... |
| Description |
Ultra-Low Resistance Dual SPDT Analog Switch
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| File Size |
116.37K /
14 Page |
View
it Online |
Download Datasheet |
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Samsung Electronic
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| Part No. |
S6B0718
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| OCR Text |
...up flow on page 48 to 51 Change bumped PAD size (modify figure 2 and table 1 on page 3) Change the PAD Center Coordinates of COM39 and COMS1. (modify table 2 on page 4) Change LCD power supply voltage (modify VOUT and V0 voltage on page1, 5... |
| Description |
104 SEG / 81 COM DRIVER & CONTROLLER FOR STN LCD
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| File Size |
703.04K /
64 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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