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美丽微半导体有限公司 Formosa Microsemi Co., Ltd.
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Part No. |
BZT52C7V5S BZT52C2V7S BZT52C2V4S BZT52C30S
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Description |
Hex Schmitt-Trigger Inverter 14-TSSOP -40 to 125 Low Current Operation at 250??A???Low Reverse Leakage,Low Noise Zener Diode(250??A?・¥?????μ?μ?????°????????????μ?μ?????????a?£°???é???o3?o???????) Quadruple Bus Buffer Gate With 3-State Outputs 14-VQFN -40 to 125 表面贴装稳压二极 3-Line To 8-Line decoder/Demultiplexer 16-TVSOP -40 to 85 表面贴装稳压二极
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File Size |
67.33K /
3 Page |
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it Online |
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Amphenol Communications Solutions |
Part No. |
L177HDC62S
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Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Socket, 0.38m (15 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77HDC62SC309
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Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Socket, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L177HDC62SD1CH4R
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Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, 0.38m (15 in) Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L177HRC62SVF
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Description |
Dsub, Straight, High Density, Crimp & Poke, Bright Tin Shell, 62 Socket, 4-40 Fixed Front Screwlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77HDC62SOL2
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Description |
Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Socket, Flash Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77HDC62SD1CH4R
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Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, Flash Gold, 4-40 Rear Threaded Insert, Ground Tab, With Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77HDC62SD1CH3FC309
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Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, 0.76m (30 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L177HDC62SVFM
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Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Socket, 0.38um (15u\\) Gold, Fixed M3 Front Screwlock, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L77HDC62SVFC309
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Description |
Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 62 Socket, 0.76m (30 in) Gold, Fixed 4-40 Front Screwlock, Without Bracket, Without Boardlock
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
L177HDC62SD1CH3F
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Description |
Dsub, Stamped Signal 3A, High Density, Right Angle PCB Thru Hole, FP=8.89mm (0.35u\\), 62 Socket, 0.38m (15 in) Gold, M3 Front Screwlock, Ground Tab, With Boardlock
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Tech specs |
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Official Product Page
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