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  clad Datasheet PDF File

For clad Found Datasheets File :: 3214    Search Time::2.032ms    
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    BAT54LT1-D

ON Semiconductor
Part No. BAT54LT1-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher t...
Description Schottky Barrier Diodes

File Size 52.16K  /  8 Page

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    BAT54SLT1-D

ON Semiconductor
Part No. BAT54SLT1-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher ...
Description Dual Series Schottky Barrier Diodes

File Size 51.88K  /  8 Page

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    M1MA151WKT2

ON SEMICONDUCTOR
Part No. M1MA151WKT2
OCR Text ...c 2. t rr test circuit thermal clad is a trademark of the bergquist company preferred devices are motorola recommended choices for future use and best overall value. order this document by m1ma151wkt1/d semiconductor technical da...
Description 0.1 A, 2 ELEMENT, SILICON, SIGNAL DIODE

File Size 120.65K  /  8 Page

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    M1MA151KT3 M1MA151KT2

MOTOROLA INC
ON SEMICONDUCTOR
Part No. M1MA151KT3 M1MA151KT2
OCR Text ...c 2. t rr test circuit thermal clad is a trademark of the bergquist company preferred devices are motorola recommended choices for future use and best overall value. order this document by m1ma151kt1/d semiconductor technical dat...
Description 0.1 A, 40 V, SILICON, SIGNAL DIODE
0.1 A, SILICON, SIGNAL DIODE

File Size 103.88K  /  8 Page

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    BAT54SWT1-D

ON Semiconductor
Part No. BAT54SWT1-D
OCR Text ...num core board such as thermal clad ? . using a board material such as thermal clad, a higher power dissipation of 300 milli- watts can be achieved using the same footprint. interface between the board and the package. with the correct pad...
Description Dual Series Schottky Barrier Diodes

File Size 61.12K  /  8 Page

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    BAT54T1-D

ON Semiconductor
Part No. BAT54T1-D
OCR Text ...inum core board such as thermal clad ? . using a board material such as thermal clad, an aluminum core board, the power dissipation can be doubled using the same footprint. soldering precautions the melting temperature of solder is higher ...
Description Schottky Barrier Diodes

File Size 53.36K  /  8 Page

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    G6AK-234P-ST40-US G6AK-234P-ST-US G6A-274P G6A-234P-ST15-US G6A-434P-ST20-US G6AK-434P-ST-US G6A-434P-ST40-US G6A-274P-S

Glenair, Inc.
Omron Electronics, LLC
Part No. G6AK-234P-ST40-US G6AK-234P-ST-US G6A-274P G6A-234P-ST15-US G6A-434P-ST20-US G6AK-434P-ST-US G6A-434P-ST40-US G6A-274P-ST15-US G6A-234P-ST-US G6AU-234P-ST-US G6A-234P-ST40-US G6A-474P-ST20-US G6A-434P-ST-US G6AU-434P-ST-US G6AK-434P-ST40-US G6AK-274P-ST40-US
OCR Text ... DPDT 4PDT Part number AgPd (Au clad) G6A-234P-ST-US G6A-434P-ST-US G6A-234P-ST15-US G6A-434P-ST20-US G6A-234P-ST40-US G6A-434P-ST40-US Ag (Au clad) G6A-274P-ST-US G6A-474P-ST-US G6A-274P-ST15-US G6A-474P-ST20-US G6A-274P-ST40-US G6A-474P-S...
Description Mechanical Relay


File Size 122.72K  /  9 Page

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    NF2EB-12V NF4EB-12V-A

Panasonic Semiconductor
Part No. NF2EB-12V NF4EB-12V-A
OCR Text ...t material movable contact gold-clad silver stationary contact gold-clad silver rating, (resistive load) max. switching power 60 w 100 va max. switching voltage 220 v ac, dc max. switching current 2 a expected life (min. operations) mecha...
Description FLATPACK RELAY

File Size 165.38K  /  3 Page

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    BAT54WT1-D

ON Semiconductor
Part No. BAT54WT1-D
OCR Text ...num core board such as thermal clad ? . using a board material such as thermal clad, a higher power dissipation of 300 milli- watts can be achieved using the same footprint. interface between the board and the package. with the correct pad...
Description Schottky Barrier Diode

File Size 60.73K  /  8 Page

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