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die wafer Datasheet PDF File

For die wafer Found Datasheets File :: 4915 Search Time::1.719ms
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				PLX Technology, Inc. NXP Semiconductors
Part No.	PCF8564ACX9_1 PCF8564ACX9_B_1 PCF8564A PCF8564AU_10AA_1 PCF8564AU_10AB_1 PCF8564AU_5BB_1 PCF8564AU_5BD_1 PCF8564AU_5GB_1 PCF8564AU_5GE_1 PCF8564ACX9/1 PCF8564ACX9/B/1 PCF8564AU/10AA/1 PCF8564AU/5BD/1 PCF8564AU/5GB/1 PCF8564AU/5GE/1 PCF8564AU/10AB/1 PCF8564AU/5BB/1
OCR Text	...dering information Package Name die type 1[1] PCF8564AU PCF8564AU PCF8564AU wire bond die; 9 bonding pads wire bond die; 9 bonding pads wire bond die; 9 bonding pads unsawn wafer; thickness 280 m unsawn wafer; thickness 687 m wafer sawn on ...
Description	REAL TIME CLOCK, UUC9 die-9 Real time clock and calendar
File Size	198.23K / 44 Page	View it Online	Download Datasheet

				Vishay Siliconix
Part No.	T1090P6-SD-F
OCR Text	...ditions. vishay optoelectronics die products are tested us ing vishay optoelectronics base d quality assurance procedures and are manufactu...wafer sawn on foil wi th disco frame moq: 250 000 pcs chip absolute maximum ratings (t amb = 25 c,...
Description	Silicon NPN Phototransistor
File Size	132.33K / 5 Page	View it Online	Download Datasheet

				ADVANCED MICRO DEVICES INC PROM Advanced Micro Devices, Inc. AMD[Advanced Micro Devices]
Part No.	AM29F010-1 AM29F010-120DGC1 AM29F010-120DGE1 AM29F010-120DGI1 AM29F010-120DPC1 AM29F010-120DPE1 AM29F010-120DPI1 AM29F010-120DTC1 AM29F010-120DTE1 AM29F010-120DTI1 AM29F010-120DWC1 AM29F010-120DWE1 AM29F010-120DWI1 AM29F010-9 AM29F010-90DGC1 AM29F010-90DWI1 AM29F010-90DGE1 AM29F010-90DGI1 AM29F010-90DPC1 AM29F010-90DPE1 AM29F010-90DPI1 AM29F010-90DTC1 AM29F010-90DTE1 AM29F010-90DTI1 AM29F010-90DWC1 AM29F010-90DWE1 AM29F010B-90DTC1 AM29F010-120DTI AM29F010B-90DTI1 AM29F010B-90DPI1 AM29F010-120DTC AM29F010B-90DPC1 AM29F010-120DPC AM29F010B-90DTE1 AM29F010B-90DGI1
OCR Text	die 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory--die Revision 1 DISTINCTIVE CHARACTERISTICS s Single power ...wafer Tray (sawn wafer on frame) Call AMD sales office for minimum order quantity SPEED OPTION Se...
Description	1 megabit CMOS 5.0 volt-only, uniform sector flash memory- die revision 1 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memorydie Revision 1 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory-die Revision 1 128K X 8 FLASH 5V PROM, 120 ns, UUC30 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory-die Revision 1 128K X 8 FLASH 5V PROM, 90 ns, UUC30 Evaluation Board for LM3202 650mA Miniature, Adjustable, Step-Down DC-DC Converter for RF Power Amplifiers 128K X 8 FLASH 5V PROM, 90 ns, UUC30 LM3202 650mA Miniature, Adjustable, Step-Down DC-DC Converter for RF Power Amplifiers; Package: MICRO SMD; No of Pins: 8 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only Uniform Sector Flash Memory-die Revision 1 1 Megabit (128 K x 8-Bit) CMOS 5.0 Volt-only/ Uniform Sector Flash Memory-die Revision 1
File Size	55.30K / 8 Page	View it Online	Download Datasheet

				KOA Speer Electronics, Inc.
Part No.	DNAN08TTE DNAN08TTEB DN2S06TTE DN2S06TTEB DNAS03T DNAS03TTE DNAS03TTEB DNAS04TTE DNAS04TTEB DNAS06TTE DNAS06TTEB DN5S03TTE DN5S03TTEB DN5S04TTE DN5S04TTEB DN5S06TTE DN5S06TTEB DN3S06TTE DN4S06TTE DN6S06TTE DN7S06TTE DN3S06TTEB
OCR Text	...truction S03 L P Bonding Wire die Pad W Molded Resin Si wafer Lead d Molded Resin W die Si Pad wafer * ESD suppression * Transient suppression S04 L p Bonding Wire Lead d Package Total Code Power S03 S04 S06 N08 225mw 225mw 22...
Description	diode terminator network
File Size	103.60K / 2 Page	View it Online	Download Datasheet

				M/A-COM Technology Solutions, Inc.
Part No.	MASW-000552-13210G
OCR Text	...witch. The backside area of the die is the RF and DC return ground plane. The DC return is connected to the common port J1. The forward bias voltage at J2 & J3 will not exceed 1.6 volts and is typically 1.4 volts with supply current of 30...
Description	SPDT AlGaAs PIN Diode Switch RoHS Compliant
File Size	101.13K / 7 Page	View it Online	Download Datasheet

				Central Semiconductor C...
Part No.	CP210-2N4416
OCR Text	die die size 15 x 15 mils die thickness 8.0 mils drain bonding pad size 3.2 x 4.0 mils source bonding pad size 3.2 x 4.0 mils g...wafer diameter 5 inches gross die per wafer 72,000 the cp210-2n4416 is a silicon n-channel jfet...
Description	N-Channel JFET die
File Size	767.85K / 4 Page	View it Online	Download Datasheet

				NXP Semiconductors
Part No.	PCF2113DU_2_F4 PCF2113DU_F4 PCF2113AU_10_F4 PCF2113DH_4 PCF2113EU_2_F4 PCF2113WU_2_F4 PCF2113X PCF2113DU/F4 PCF2113DU/2/F4 PCF2113WU/2/F4 PCF2113EU/2/F4 PCF2113DH/4 PCF2113AU/10/F4
OCR Text	...nsions Height difference in one die Convex deformation Pad size (aluminium) Passivation opening Pad pitch wafer thickness (excluding bumps) die size X die size Y [1] [2] 3.52 3.36 mm mm Fab 1 identification starts with nnnnnn, whe...
Description	LCD controllers/drivers
File Size	374.68K / 65 Page	View it Online	Download Datasheet

				New Japan Radio
Part No.	NJU6214 NJU6214AW-L NJU6214CC-V NJU6214XC-X
OCR Text	..."Variable Pull-up Resistance on-die "Oscillation Capacitors Cg and Cg on-die "Package Outline die/wafer "C-MOS Technology !LINE-UP TABLE Type No. FOUT Internal Connect Short Open N A B B A 2 B A 4 B A 8 B A 16 Cg/Cd 9.3/10.7pF 9.3/10.7pF 9....
Description	Small-Sized 1.8V Operating Voltage Fundamental Quartz Crystal Oscillator IC
File Size	129.44K / 7 Page	View it Online	Download Datasheet

				Integrated Device Techn...
Part No.	ZSC31150GAG1 ZSC31150MCSV1P1 ZSC31150GEG2-R ZSC31150GEG1
OCR Text	...able flank s ), ssop14, and die zsc31150 a pplication circuit 2 1 3 4 6 5 7 1 4 1 3 1 2 1 1 1 0 8 s e r i a l i n t e r f a ...wafer: add b to sales code sawn on wafer frame: add c waffle pack: add d zsc31150geg2 - ...
Description	Fast Automotive Sensor Signal Conditioner
File Size	650.94K / 26 Page	View it Online	Download Datasheet

For die wafer Found Datasheets File :: 4915 Search Time::1.719ms
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