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  1513-30Y Datasheet PDF File

For 1513-30Y Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    NXP Semiconductors N.V.
Part No. PSMN3R7-30YLC
Description N-channel 30 V 3.95m logic level MOSFET in LFPAK using NextPower technology
N-channel 30 V 3.95mΩ logic level MOSFET in LFPAK using NextPower technology

File Size 334.35K  /  15 Page

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Amphenol Communications Solutions

Part No. 51915-139LF
Description PwrBlade®, Power Connectors, 6P 16S 3ACP Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    PSMN4R1-30YLC-15

NXP Semiconductors
Part No. PSMN4R1-30YLC-15
Description N-channel 30 V 4.35mΩ logic level MOSFET in LFPAK using NextPower technology

File Size 314.91K  /  14 Page

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Amphenol Communications Solutions

Part No. 77315-134-20LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    NXP Semiconductors N.V.
Part No. PSMN7R0-30YLC
Description N-channel 30 V 7.1 m logic level MOSFET in LFPAK using NextPower technology
N-channel 30 V 7.1 mΩ logic level MOSFET in LFPAK using NextPower technology

File Size 312.19K  /  15 Page

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Amphenol Communications Solutions

Part No. 51915-132LF
Description PwrBlade®, Power Connectors, 12P 24S Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

    NXP Semiconductors N.V.
Part No. PSMN2R2-30YLC
Description N-channel 30 V 2.15m logic level MOSFET in LFPAK using NextPower technology
N-channel 30 V 2.15mΩ logic level MOSFET in LFPAK using NextPower technology

File Size 334.37K  /  15 Page

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Amphenol Communications Solutions

Part No. 95615-132LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Header- Through Mount - Double row - 32 Positions - 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    PSMN4R0-30YLD-15

NXP Semiconductors
Part No. PSMN4R0-30YLD-15
Description N-channel 30 V, 4.0 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology

File Size 360.84K  /  13 Page

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Amphenol Communications Solutions

Part No. 68015-132HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 32 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    PSMN2R0-30YLE

NXP Semiconductors
Part No. PSMN2R0-30YLE
Description N-channel 30 V 2 mlogic level MOSFET in LFPAK

File Size 221.10K  /  13 Page

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Amphenol Communications Solutions

Part No. 95615-130TRLF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Header- Through Mount - Double row - 30 Positions - 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    PSMN1R5-30YLC

NXP Semiconductors
Part No. PSMN1R5-30YLC
Description N-channel 30 V 1.55mlogic level MOSFET in LFPAK using NextPower technology

File Size 335.05K  /  15 Page

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Amphenol Communications Solutions

Part No. 68015-136HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    PSMN1R2-30YLC

NXP Semiconductors
Part No. PSMN1R2-30YLC
Description N-channel 30 V 1.25mlogic level MOSFET in LFPAK using NextPower technology

File Size 330.88K  /  15 Page

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Amphenol Communications Solutions

Part No. 51915-136LF
Description PwrBlade®, Power Connectors, 6P 16S 3ACP Right Angle Receptacle, Solder To Board
Tech specs    

Official Product Page

    NXP Semiconductors N.V.
Part No. PSMN1R5-30YLC
Description N-channel 30 V 1.55m logic level MOSFET in LFPAK using NextPower technology

File Size 335.60K  /  15 Page

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Amphenol Communications Solutions

Part No. 68015-131HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 31 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    MAXIM - Dallas Semiconductor
Part No. DS1330YL-70
Description 256k Nonvolatile SRAM with Battery Monitor

File Size 191.03K  /  10 Page

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Amphenol Communications Solutions

Part No. 77315-135-20LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions 2.54mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

For 1513-30Y Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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