Description |
x32 eeprom Module 150ns, TSOP, IND TEMP(eeprom) 150ns, PDIP, IND TEMP(eeprom) 150ns, FLATPACK, 883C; LEV B CMPLNT(eeprom) 150ns, PLCC, COM TEMP(eeprom) 200ns, FLATPACK, 883C; LEV B COMPLIANT(eeprom) 150ns, 44LCC, 883C; LEV B COMPLIANT(eeprom) 350ns,PGA,883C; LEVEL B FULLY COMPLIANT(eeprom) 150ns, PGA, 883C; LEV B FULLY COMPLIANT(eeprom) 250ns, 32LCC, 883C; LEV B COMPLIANT(eeprom) 250ns, CERDIP, 883C; LEV B COMPLIANT(eeprom) 150ns, CERDIP, 883C; LEV B COMPLIANT(eeprom) 250ns, PGA, 883C; LEV B FULLY COMPLIANT(eeprom) 120ns, PGA, 883C; LEV B FULLY COMPLIANT(eeprom) 150ns, PLCC, AUTO TEMP(eeprom) x32号的eeprom模块 150ns, CERDIP, 883C; LEV B COMPLIANT(eeprom) x32号的eeprom模块 200ns, CERDIP, 883C; LEV B COMPLIANT(eeprom) x32号的eeprom模块 DIE(eeprom) x32号的eeprom模块 200ns, PDIP, IND TEMP(eeprom)
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