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MICROSEMI[Microsemi Corporation]
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| Part No. |
LX5506M
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| OCR Text |
...X5506M is available in a 16-pin 3mmx3mm micro-lead package (MLP). The compact footprint, low profile, and excellent thermal capability of the MLP package makes the LX5506M an ideal solution for broadband, high-gain power amplifier requireme... |
| Description |
InGaP HBT 4.5 - 6GHz Power Amplifier
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| File Size |
62.03K /
2 Page |
View
it Online |
Download Datasheet
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MICROSEMI[Microsemi Corporation]
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| Part No. |
LX5503-LQ LX5503
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| OCR Text |
...LX5503 is available in a 16-pin 3mmx3mm micro-lead package (MLP). The compact footprint, low profile, and excellent thermal capability of the MLP package makes the LX5503 an ideal solution for broadband, medium-gain power amplifier requirem... |
| Description |
InGaP HBT 5-6GHz Power Amplifier
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| File Size |
469.73K /
13 Page |
View
it Online |
Download Datasheet
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Price and Availability
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