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  49463-1417 Datasheet PDF File

For 49463-1417 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

   
Part No. HYB514175BJL-55
Description x16 EDO Page Mode DRAM

File Size 573.69K  /  24 Page

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Amphenol Communications Solutions

Part No. 76341-417LF
Description Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 17 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Microchip Technology, Inc.
Part No. NN514170LJ-45 NN514170LJ-50 NN514170LJ-70 NN514170LJ-60 NN514170J-50 NN514170J-70 NN514170LTT-70 NN514170J-45
Description x16 Fast Page Mode DRAM x16快速页面模式的DRAM

File Size 654.84K  /  24 Page

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Amphenol Communications Solutions

Part No. 68771-417HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Vertical, 6.86 mm (0.27 in.) Mating, 2.54 mm (0.1 in.) Tail
Tech specs    

Official Product Page

    SIEMENS AG
Part No. HYB514175BJ-50- Q67100-Q2100 HYB514175BJ-55 HYB514175BJ-60
Description 256k x 16-Bit EDO-DRAM 256k x 16位江户的DRAM
256k × 16-Bit Dynamic RAM(256k × 16动RAM) 256k × 16位动态随机存储器56k × 16位动态内存)

File Size 180.37K  /  22 Page

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Amphenol Communications Solutions

Part No. 54121-108141700LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. HYB314171BJL-70 HYB314171BJL-60 HYB314171BJL-50 HYB314171BJ-70 HYB314171BJ-60 HYB314171BJ-50 HB314171 HYB314171BJ-50-
Description 256k x 16 Bit FPM DRAM 3.3 V 60 ns
-3.3V 256 K x 16-Bit Dynamic RAM 3.3V Low Power 256 K x 16-Bit Dynamic RAM with Self Refresh
256k x 16 Bit FPM DRAM 3.3 V 70 ns
From old datasheet system

File Size 1,337.62K  /  24 Page

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Amphenol Communications Solutions

Part No. 77314-178LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

   
Part No. HM514170CLJ-7 HM514170CTT-7
Description x16 Fast Page Mode DRAM

File Size 653.03K  /  26 Page

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Amphenol Communications Solutions

Part No. 94611-417HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 17 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    SIEMENS AG
Part No. HYB514171BJ-50- Q67100-Q727 Q67100-Q2021 HYB514171BJ-60
Description 256k x 16-Bit Dynamic RAM
256k × 16-Bit Dynamic RAM(256k × 16动RAM) 256k × 16位动态随机存储器56k × 16位动态内存)

File Size 184.28K  /  23 Page

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Amphenol Communications Solutions

Part No. 10141731-005RLF
Description DDR4 SODIMM 260pin SMT, 5.2H, reverse version., Right Angle
Tech specs    

Official Product Page

    HYB514171BJ-50 HYB514171BJ-50- HYB514171BJ-60 Q67100-Q727 Q67100-Q2021

SIEMENS[Siemens Semiconductor Group]
Infineon
Part No. HYB514171BJ-50 HYB514171BJ-50- HYB514171BJ-60 Q67100-Q727 Q67100-Q2021
Description 256k x 16 Bit FPM DRAM 5 V 60 ns
256k x 16 Bit FPM DRAM 5 V 50 ns
256k x 16-Bit Dynamic RAM

File Size 179.75K  /  23 Page

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Amphenol Communications Solutions

Part No. 10141733-004RLF
Description DDR4 SODIMM 260pin SMT, 9.2H, REVERSE VERSION, Right Angle
Tech specs    

Official Product Page

    HYB514175BJ-60 HYB514175BJ-55 HYB514175BJ-50 Q67100-Q2072 Q67100-Q2073 HYB514175BJ-50- Q67100-Q2100

Infineon
SIEMENS[Siemens Semiconductor Group]
Part No. HYB514175BJ-60 HYB514175BJ-55 HYB514175BJ-50 Q67100-Q2072 Q67100-Q2073 HYB514175BJ-50- Q67100-Q2100
Description 256k x 16 Bit EDO DRAM 5 V 50 ns
256k x 16 Bit EDO DRAM 5 V 60 ns
256k x 16 Bit EDO DRAM 5 V 55 ns
256k x 16-Bit EDO-DRAM

File Size 176.03K  /  22 Page

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Amphenol Communications Solutions

Part No. 77314-175RLF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Double Row, 40 Positions, 2.54 mm (0.100) Pitch.
Tech specs    

Official Product Page

    http://
SIEMENS AG
Part No. HYB314175BJ-50- HYB314175BJL-50 HYB314175BJ-60 HYB314175BJ-55 HYB314175BJL-60 HYB314175BJL-55 Q67100-Q2149 HYB314175BJ-50
Description High-Speed Fully-Differential Amplifiers 8-MSOP-PowerPAD -40 to 85 3.3V56亩16位江户的DRAM 3.3V56亩16位江户与DRAM的低功率版本自刷
3.3V 256 K x 16-Bit EDO-DRAM 3.3V 256 K x 16-Bit EDO-DRAM Low power version with Self Refresh
3.3V 256 K x 16-Bit EDO-DRAM(3.3V 256K×16外延式数据输出(EDO)动态RAM)

File Size 1,310.29K  /  24 Page

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Amphenol Communications Solutions

Part No. 91601-417LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical , Surface Mount, Dual Entry ,Single row , 17 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    MC74HC367A MC74HC367AD MC74HC367ADT MC74HC367AN ON1417 MC74HC367A-D

Motorola Mobility Holdings, Inc.
ONSEMI[ON Semiconductor]
Part No. MC74HC367A MC74HC367AD MC74HC367ADT MC74HC367AN ON1417 MC74HC367A-D
Description Telecomm/Datacomm HC/UH SERIES, 6-BIT DRIVER, TRUE OUTPUT, PDSO16
From old datasheet system
Hex 3-State Noninverting Buffer with Separate 2-Bit and 4-Bit Sections
Hex 3-State NonInverting Buffer with Separate 2-Bit and 4-Bit Section High-Performance Silicon-Gate CMOS

File Size 151.06K  /  6 Page

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Amphenol Communications Solutions

Part No. 89891-417LF
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 34 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

For 49463-1417 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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