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  87834-1419 Datasheet PDF File

For 87834-1419 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    0878343495 87834-3495

Molex Electronics Ltd.
Part No. 0878343495 87834-3495
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.05μm (2μ) Gold (Au) Plating

File Size 115.69K  /  3 Page

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Amphenol Communications Solutions

Part No. 68001-419HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, , 19 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0878343492 87834-3492

Molex Electronics Ltd.
Part No. 0878343492 87834-3492
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 34 Circuits, 0.13μm (5μ) Gold (Au) Plating, End Windows, with Pin 5 Voided

File Size 100.67K  /  3 Page

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Amphenol Communications Solutions

Part No. 68461-419HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Right Angle, 10.16 mm (0.4 in.) Mating, 8.13 mm (0.32 in.) Tail
Tech specs    

Official Product Page

    0878343441 87834-3441

Molex Electronics Ltd.
Part No. 0878343441 87834-3441
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13μm (5μ) Gold (Au) Flash Plating
2.54mm (.100) Pitch C-Grid庐 Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, 0.13渭m (5渭) Gold (Au) Flash Plating

File Size 113.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 78511-419HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0878343421 87834-3421

http://
Molex Electronics Ltd.
Part No. 0878343421 87834-3421
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.52K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-419-12LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 12 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

    0878343419 87834-3419

Molex Electronics Ltd.
Part No. 0878343419 87834-3419
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 34 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.43K  /  3 Page

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Amphenol Communications Solutions

Part No. 54111-419051700LF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded vertical stacked header, Through Hole, Single Row, 5 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0878343417 87834-3417

Molex Electronics Ltd.
Part No. 0878343417 87834-3417
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, without PCB Locator, without End Window, Gold (Au) Flash, Polyester Housing

File Size 105.13K  /  3 Page

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Amphenol Communications Solutions

Part No. 10141995-005RLF
Description DDR4 SODIMM 260pin SMT, 8.0H, STANDARD VERSION, Right Angle
Tech specs    

Official Product Page

    0878343411 87834-3411

Molex Electronics Ltd.
Part No. 0878343411 87834-3411
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, Lead-free, 34 Circuits, Gold (Au) Flash, Beige, PCB Locators, without End Window

File Size 127.68K  /  3 Page

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Amphenol Communications Solutions

Part No. 76341-419LF
Description Dubox® 2.54mm, Board to Board Connector, PCB mounted Receptacle, Vertical, Through Hole, Top Entry, Single row , 19 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    0878342621 87834-2621

Molex Electronics Ltd.
Part No. 0878342621 87834-2621
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating
MOLEX Connector

File Size 124.51K  /  3 Page

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Amphenol Communications Solutions

Part No. 94611-419HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 19 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87834-4019 0878344019

Molex Electronics Ltd.
Part No. 87834-4019 0878344019
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, 40 Circuits, 0.13μm (5μ) Gold (Au) Plating, Black, without PCB Locator

File Size 115.26K  /  3 Page

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Amphenol Communications Solutions

Part No. U77C14192001
Description ExpressPort SFP+, High Speed Input Output Connectors, 1X1 SFPP CAGE W/ LP.
Tech specs    

Official Product Page

    87834-1421 0878341421

Molex Electronics Ltd.
Part No. 87834-1421 0878341421
Description 2.54mm (.100) Pitch C-Grid? Header, Dual Row, Low Profile, Vertical, Shrouded, PCB Locators, with End Windows, 0.13μm (5μ) Gold (Au) Flash Plating, Nylon Housing

File Size 124.17K  /  3 Page

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Amphenol Communications Solutions

Part No. 77311-419-06LF
Description BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 06 Positions, 2.54 mm Pitch.
Tech specs    

Official Product Page

For 87834-1419 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

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