Part Number Hot Search : 
IC1427 AD1954 MAX3373 HL6328MG CS19201 TN0604WG P30300 512K32
Product Description
Full Text Search
  bondable Datasheet PDF File

For bondable Found Datasheets File :: 291    Search Time::2.844ms    
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    SKCD16C060IHD10

Semikron International
Part No. SKCD16C060IHD10
OCR Text ...m 2 area total 15.76 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 651 (5" wafer) pcs skcd 16 c 060 i hd 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrosta...
Description CAL-DIODE

File Size 62.99K  /  2 Page

View it Online

Download Datasheet





    SKCD24C060IHD10

Semikron International
Part No. SKCD24C060IHD10
OCR Text ...m 2 area total 24.01 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 422 (5" wafer) pcs skcd 24 c 060 i hd 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrosta...
Description CAL-DIODE

File Size 63.44K  /  2 Page

View it Online

Download Datasheet

    EMP15P12D

International Rectifier
Part No. EMP15P12D
OCR Text ...dard and well know dbc (direct bondable copper): over a thick copper base an allumina (al 2 o 3 ) substrate with a 300 m copper foil on both side is placed and igbts and diodes dies are directly soldered, through screen printing proces...
Description Programmable solated intelligent power module, a 15A, 1200V, three-phase inverter for 15kW industrial and servo motors

File Size 837.75K  /  16 Page

View it Online

Download Datasheet

    MA4M3050 MA4M2020 MA4M2300 MA4M3150 MA4M3030 MA4M1050 MA4M1100 MA4M3010

M/A-COM Technology Solutions, Inc.
Part No. MA4M3050 MA4M2020 MA4M2300 MA4M3150 MA4M3030 MA4M1050 MA4M1100 MA4M3010
OCR Text ...s are used to provide an easily bondable metal pad on the capacitor chip. M/A-Com MNS capacitors have shown no measurable capacitance change when subjected to the rated standoff voltage at 150 Degrees C. The MA4M series of chip capacitors i...
Description MNS Microwave Chip Capacitors

File Size 119.41K  /  4 Page

View it Online

Download Datasheet

    SKCD08C120I4F

Semikron International
Part No. SKCD08C120I4F
OCR Text ...total 8 mm2 anode metallization bondable (al) cathode metallization solderable (ag/ni) wire bond al, typ. diameter = 300 m package wafer frame chips / package 1894 pcs skcd 08 c 120 i4f 2 rev. 0 ? 16.03.2011 ? by semikron this is an elec...
Description CAL-DIODE

File Size 103.02K  /  2 Page

View it Online

Download Datasheet

    MS7218-A2

Intersema Sensoric SA
Part No. MS7218-A2
OCR Text ... wire bonding the bondable area is 100 x 100 m 2 for the epi pad and 100 x 285 m 2 for the other pads. the location of the bonding pads is close to the top pyrex glass edge r educing the possible size and angle of the b...
Description PRESSURE SENSOR DIE (0-18 BAR) FOR HARSH ENVIRONMENT

File Size 230.42K  /  4 Page

View it Online

Download Datasheet

    Solid States Devices, Inc.
Part No. SEP0525
OCR Text ...rature ? solderable top or wire bondable metal scheme available sh0006a data sheet #: 5 amps 25 volts super schottky rectifier rectifier die maximum ratings 25 o c -55 to +100 top & tstg 5 amps io volts symbol units value v r peak repetitiv...
Description 5 AMPS 25 VOLTS SUPER SCHOTTKY RECTIFIER

File Size 41.80K  /  2 Page

View it Online

Download Datasheet

    SKCD23C120I310

Semikron International
Part No. SKCD23C120I310
OCR Text ...m 2 area total 23.16 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package wafer frame chips / package 423 (5" wafer) pcs skcd 23 c 120 i3 2 rev. 0 ? 18.02.2010 ? by semikron this is an electrostati...
Description CAL-DIODE

File Size 81.53K  /  2 Page

View it Online

Download Datasheet

    SKR12 SKR4

Semikron International
Part No. SKR12 SKR4
OCR Text ...mm area total 153,76 mm 2 anode bondable (al) cathode solderable (ag/ni) wire bond al, diameter 500 m package tray chips / package 36 pcs skr 12,4 qu bond 2 rev. 0 ? 22.09.2009 ? by semikron this technical information specifies semico...
Description DIODE

File Size 91.75K  /  2 Page

View it Online

Download Datasheet

    Microchip Technology Inc.
Part No. DV103001 DV103002 DV103003
OCR Text ...ices are available in bumped or bondable wafer format which makes them suitable for smart labels and flip-chip style assembly. package options include: die, wafer, wafer-on- frame, bumped wafer-on-frame, pdip, soic and cob modules. microchi...
Description
File Size 198.81K  /  2 Page

View it Online

Download Datasheet

For bondable Found Datasheets File :: 291    Search Time::2.844ms    
Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

▲Up To Search▲

 




Price and Availability




 
Price & Availability of bondable

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X
2.7773849964142