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    74AC240CW 74ACT240CW

Fairchild Semiconductor
Part No. 74AC240CW 74ACT240CW
OCR Text ...e 74ac240mtc mtc20 20-lead thin shrink small outline package (tssop), jedec mo-153,4.4mm wide 74ac240pc n20a 20-lead plastic dual-in-line package (pdip), jedec ms-001, 0.300 ? wide 74act240sc m20b 20-lead small outline integrated circuit (...
Description Octal Buffer/Line Driver with 3-STATE Outputs

File Size 88.18K  /  8 Page

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    P89LPC9341FDH P89LPC9361FDH P89LPC9331HDH P89LPC9351FA P89LPC9331FDH

NXP Semiconductors
Part No. P89LPC9341FDH P89LPC9361FDH P89LPC9331HDH P89LPC9351FA P89LPC9331FDH
OCR Text ...SSOP28 Description plastic thin shrink small outline package; 28 leads; body width 4.4 mm plastic thin shrink small outline package; 28 leads; body width 4.4 mm plastic thin shrink small outline package; 28 leads; body width 4.4 mm plastic ...
Description 8-bit microcontroller with accelerated two-clock 80C51 core, 4 kB/8 kB/16 kB 3 V byte-erasable flash with 8-bit ADCs

File Size 394.14K  /  93 Page

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    SC16IS740IPW SC16IS750 SC16IS750IBS SC16IS750IPW SC16IS760 SC16IS760IBS SC16IS760IPW SC16IS740IPW112 SC16IS760IPW112 SC1

NXP Semiconductors N.V.
Part No. SC16IS740IPW SC16IS750 SC16IS750IBS SC16IS750IPW SC16IS760 SC16IS760IBS SC16IS760IPW SC16IS740IPW112 SC16IS760IPW112 SC16IS750IPW128 SC16IS760IBS157 SC16IS760IPW128
OCR Text ...SSOP24 Description plastic thin shrink small outline package; 16 leads; body width 4.4 mm plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm plastic thin shrink small outline package; 24 leads...
Description Single UART with I2C-bus/SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support; Package: SOT403-1 (TSSOP16); Container: Tube 1 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PDSO16
Single UART with I2C-bus/SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support; Package: SOT355-1 (TSSOP24); Container: Tube 1 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PDSO24
Single UART with I2C-bus/SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support; Package: SOT355-1 (TSSOP24); Container: Reel Pack, SMD, 13&quot;, Turned 1 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PDSO24
Single UART with I2C-bus/SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support; Package: SOT616-3 (HVQFN24); Container: Tray Pack, Bakeable, Multiple 1 CHANNEL(S), 5M bps, SERIAL COMM CONTROLLER, PQCC24
   Single UART with I2C-bus/SPI interface, 64 bytes of transmit and receive FIFOs, IrDA SIR built-in support

File Size 293.72K  /  62 Page

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    SC18IS603IPW SC18IS602 SC18IS602B SC18IS602BIPW SC18IS602IPW SC18IS603 SC18IS603IPW128

NXP Semiconductors N.V.
Part No. SC18IS603IPW SC18IS602 SC18IS602B SC18IS602BIPW SC18IS602IPW SC18IS603 SC18IS603IPW128
OCR Text ...SSOP16 Description plastic thin shrink small outline package; 16 leads; body width 4.4 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm Version ...
Description I2C-bus to SPI bridge; Package: SOT403-1 (TSSOP16); Container: Reel Pack, SMD, 13&quot;, Turned I2C BUS CONTROLLER, PDSO16

File Size 119.93K  /  25 Page

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    74LVT16244B 74LVT16244BDGG 74LVT16244BEV 74LVT16244B06 74LVT16244BDL 74LVTH16244BDGG

NXP Semiconductors
Part No. 74LVT16244B 74LVT16244BDGG 74LVT16244BEV 74LVT16244B06 74LVT16244BDL 74LVTH16244BDGG
OCR Text ...P48 TSSOP48 Description plastic shrink small outline package; 48 leads; body width 7.5 mm plastic thin shrink small outline package; 48 leads; body width 6.1 mm plastic very thin fine-pitch ball grid array package; 56 balls; body 4.5 x 7 x ...
Description 3.3 V 16-bit buffer/driver; 3-state

File Size 87.79K  /  16 Page

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    TDA9885 TDA9885HN_V3 TDA9885HN_V5 TDA9885T_V3 TDA9885T_V5 TDA9885TS_V3 TDA9885TS_V5 TDA9886 TDA9886HN_V4 TDA9886HN_V5 TD

NXP Semiconductors
Part No. TDA9885 TDA9885HN_V3 TDA9885HN_V5 TDA9885T_V3 TDA9885T_V5 TDA9885TS_V3 TDA9885TS_V5 TDA9886 TDA9886HN_V4 TDA9886HN_V5 TDA9886T_V4 TDA9886TS_V4 TDA9886TS_V5
OCR Text ...eads; body width 7.5 mm plastic shrink small outline package; 24 leads; body width 5.3 mm plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm plastic small outline package; 24 leads; body width...
Description I2C-bus controlled single and multistandard alignment-free IF-PLL demodulators

File Size 263.14K  /  56 Page

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    PCA9701 PCA9701D PCA9701HF PCA9701PW PCA9701PW_Q100 PCA9702 PCA9702PW

NXP Semiconductors
Part No. PCA9701 PCA9701D PCA9701HF PCA9701PW PCA9701PW_Q100 PCA9702 PCA9702PW
OCR Text ...dy 4 x 4 x 0.75 mm plastic thin shrink small outline package; 24 leads; body width 4.4 mm plastic thin shrink small outline package; 24 leads; body width 4.4 mm plastic thin shrink small outline package; 16 leads; body width 4.4 mm PCA97...
Description 18 V tolerant SPI 16-bit/8-bit GPI with INT

File Size 150.08K  /  28 Page

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    74AC08

Fairchild Semiconductor
Part No. 74AC08
OCR Text ...YPE II, 5.3mm Wide 14-Lead Thin shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narr...
Description Quad 2-Input AND Gate

File Size 294.69K  /  10 Page

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