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  90136-2306 Datasheet PDF File

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    WTC2306A

Weitron Technology
Part No. WTC2306A
Description N-Channel Enhancement Mode Power MOSFET

File Size 417.51K  /  6 Page

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    KI2306DS

Guangdong Kexin Industrial Co.,Ltd
Part No. KI2306DS
Description N-Channel 30-V (D-S) MOSFET

File Size 43.40K  /  2 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0901361104 90136-1104

Molex Electronics Ltd.
Part No. 0901361104 90136-1104
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 4 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 4 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-2308 0901362308

Molex Electronics Ltd.
Part No. 90136-2308 0901362308
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 65823-067LF
Description Quickie Header, Wire to Board Connector, Double Row, 20 Positions, 2.54 mm (0.1 in.), Right Angle, Eject Latch Header 30u\\/0.76um Au/GXT Plating.
Tech specs    

Official Product Page

    90136-2307 0901362307

Molex Electronics Ltd.
Part No. 90136-2307 0901362307
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Right Angle, Shrouded, 7 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 7 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.33K  /  5 Page

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Amphenol Communications Solutions

Part No. 65823-063
Description Quickie Header, Wire to Board Connector, Double Row, 16 Positions, 2.54 mm (0.1 in.), Right Angle Header 0.76 um (30 u\\.) Gold Mating Plating.
Tech specs    

Official Product Page

    90136-1207 0901361207

Molex Electronics Ltd.
http://
Part No. 90136-1207 0901361207
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. G8230613YBTHR
Description Board mount - Header Plug - Box Header 2.0mm Pitch Vertical,2x3Pin,30u\\ Gold,NY4T,TAIL=2.5mm
Tech specs    

Official Product Page

    90136-1204 0901361204

Molex Electronics Ltd.
Part No. 90136-1204 0901361204
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 72306-040LF
Description Card Bus Ass'y, Above Mount, D/D(136Pins), VTB, Type 123, 3.3V, 4.3mm s/o, Non-Eject
Tech specs    

Official Product Page

    90136-1208 0901361208

Molex Electronics Ltd.
Part No. 90136-1208 0901361208
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. G8230612YBEU
Description Board mount - Header Receptacle - Box Header 2.0mm Pitch Vertical DIP,2x3Pin,15u\\ Gold,NY4T,Tail=2.5mm,Color-Black,Tray
Tech specs    

Official Product Page

    90136-1203 0901361203

Molex Electronics Ltd.
Part No. 90136-1203 0901361203
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 3 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 68682-306LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Through Hole, Dual Entry, Double Row, 12 Position ,2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    90136-1209 0901361209

Molex Electronics Ltd.
Part No. 90136-1209 0901361209
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 9 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 9 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 159.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 89882-306LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Right Angle, Through Hole, Top Entry, Single row ,6 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

For 90136-2306 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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