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  A82-10250 Datasheet PDF File

For A82-10250 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    TA8273H

TOSHIBA[Toshiba Semiconductor]
Part No. TA8273H
Description TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic

File Size 247.08K  /  13 Page

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Amphenol Communications Solutions

Part No. 61083-102500LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 100 Positions.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    NEC Corp.
Part No. PA826TF
Description High-Frequecy Low-Noise Amplifier NPN Transistor(高频低噪声放大器NPN晶体

File Size 76.13K  /  12 Page

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Amphenol Communications Solutions

Part No. 54112-811102500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    BA82909

Rohm
Part No. BA82909
Description Serial / Parallel 5-input Driver

File Size 252.17K  /  8 Page

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Amphenol Communications Solutions

Part No. 87610-250LF
Description Quickie® Shrouded Low Profile Header, Wire To Board, Vertical, Through Hole, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TA8229K

TOSHIBA[Toshiba Semiconductor]
Part No. TA8229K
Description LOW FREQUENCY POWER AMPLIFIER

File Size 444.68K  /  11 Page

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Amphenol Communications Solutions

Part No. 93690-102-50LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 50 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    TDA8213

ST Microelectronics
STMICROELECTRONICS[STMicroelectronics]
Part No. TDA8213
Description VIDEO & SOUND IF SYSTEM

File Size 130.77K  /  8 Page

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Amphenol Communications Solutions

Part No. 54242-111102500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    A82C250

Philips Semiconductors
Part No. A82C250
Description Search -> PCA82C250

File Size 146.64K  /  20 Page

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Amphenol Communications Solutions

Part No. 54121-816102500LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    ROHM[Rohm]
Part No. BA8204F BA8204
Description Tone ringer IC for telephone set

File Size 117.29K  /  6 Page

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Amphenol Communications Solutions

Part No. 54242-102500950LF
Description BergStik®, Board to Board connector, Unshrouded vertical stacked header, Surface Mount, Double Row, 50 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    NEC Corp.
Part No. PA821TF
Description High-Frequecy Low-Noise Amplifier NPN Transistor(高频低噪声放大器NPN晶体

File Size 81.79K  /  16 Page

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Amphenol Communications Solutions

Part No. 54122-111102500LF
Description BergStik, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking header, Through Hole, Double Row, 10 Positions.
Tech specs    

Official Product Page

    TBA820 TBA820M

STMICROELECTRONICS[STMicroelectronics]
Part No. TBA820 TBA820M
Description 1.2W AUDIO AMPLIFIER

File Size 78.12K  /  6 Page

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Amphenol Communications Solutions

Part No. 95278-102-50LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 50 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    ST Microelectronics
Part No. TDA8202
Description TV Stereo Decoder and Audio Processor

File Size 455.42K  /  14 Page

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Amphenol Communications Solutions

Part No. 77313-102-50LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 50 Positions
Tech specs    

Official Product Page

For A82-10250 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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