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  atmosphere Datasheet PDF File

For atmosphere Found Datasheets File :: 4772    Search Time::1.141ms    
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    TriQuint Semiconductor, Inc.
Part No. TGA4046
OCR Text ... conveyor furnace with reducing atmosphere should be used. ? no fluxes should be utilized. ? coefficient of thermal expansion matching is critical for long-term reliability. ? devices must be stored in a dry nitrogen atmosphere. compo...
Description 2W Q Band High Power Amplifier

File Size 353.91K  /  10 Page

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    ADP1101 ADP1281 ADP1141 ADP1261 ADP1241 ADP1211 ADP1221 ADP1271 ADP1251 ADP1 ADP1291 ADP1111 ADP1121 ADP1131 ADP1132 ADP

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Electronic Theatre Controls, Inc.
Matsushita Electric Works(Nais)
ETC[ETC]
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Part No. ADP1101 ADP1281 ADP1141 ADP1261 ADP1241 ADP1211 ADP1221 ADP1271 ADP1251 ADP1 ADP1291 ADP1111 ADP1121 ADP1131 ADP1132 ADP1151 ADP1161 ADP1171 ADP1181 ADP1191 ADP1201 ADP1231 ADP1232
OCR Text ...nsor DIP type is exposed to the atmosphere, do not allow flux to enter inside. 3. Cleaning 1) Since the pressure sensor chip is exposed to the atmosphere, do not allow cleaning fluid to enter inside. 2) Avoid ultrasonic cleaning since this ...
Description    PRECISION SEMICONDUCTOR PRESSURE SENSOR

File Size 68.39K  /  4 Page

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    TGA2505

TriQuint Semiconductor
Part No. TGA2505
OCR Text ... conveyor furnace with reducing atmosphere should be used. no fluxes should be utilized. coefficient of thermal expansion matching is critical for long-term reliability. devices must be stored in a dry nitrogen atmosphere. componen...
Description 13 - 17 GHz 2.5 Watt, 25dB Power Amplifier

File Size 171.92K  /  11 Page

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    TriQuint Semiconductor,Inc.
Part No. TGA4817-EPU
OCR Text ... conveyor furnace with reducing atmosphere should be used. ? no fluxes should be utilized. ? coefficient of thermal expansion matching is critical for long-term reliability. ? devices must be stored in a dry nitrogen atmosphere. compo...
Description 10Gb/s Wide Dynamic Range Differential TIA

File Size 408.89K  /  9 Page

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    TriQuint Semiconductor,Inc.
TriQuint Semiconductor, Inc.
Part No. TGA4517-EPU TRIQUINTSEMICONDUCTORINC-TGA4517-EPU
OCR Text ... conveyor furnace with reducing atmosphere should be used. no fluxes should be utilized. coefficient of thermal expansion matching is critical for long-term reliability. devices must be stored in a dry nitrogen atmosphere. componen...
Description Ka-Band Power Amplifier 31000 MHz - 37000 MHz RF/MICROWAVE WIDE BAND HIGH POWER AMPLIFIER

File Size 136.91K  /  10 Page

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    TriQuint Semiconductor, Inc.
Part No. TGA8014-SCC TGA8014-SCC-15
OCR Text ... conveyor furnace with reducing atmosphere should be used. no fluxes should be utilized. coefficient of thermal expansion matching is critical for long-term reliability. devices must be stored in a dry nitrogen atmosphere. componen...
Description 6 - 18 GHz Power Amplifier

File Size 176.79K  /  10 Page

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    Mimix Broadband, Inc.
Part No. CMM-5-BD-000X
OCR Text ...dm6030hk-pt cured in a nitrogen atmosphere per manufacturer's cure schedule. apply epoxy sparingly to avoid getting any on to the top surface of the die. an epoxy fillet should be visible around the total die periphery. for additional info...
Description 2.0-6.0 GHz GaAs MMIC Amplifier

File Size 1,144.52K  /  5 Page

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    TriQuint Semiconductor,Inc.
Part No. TGP2100-EPU
OCR Text ... conveyor furnace with reducing atmosphere should be used. ? no fluxes should be utilized. ? coefficient of thermal expansion matching is critical for long-term reliability. ? devices must be stored in a dry nitrogen atmosphere. compo...
Description 30 GHz 5-Bit Phase Shifter

File Size 218.28K  /  9 Page

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    TriQuint Semiconductor,Inc.
Part No. TGA4600-EPU
OCR Text ... conveyor furnace with reducing atmosphere should be used. no fluxes should be utilized. coefficient of thermal expansion matching is critical for long-term reliability. devices must be stored in a dry nitrogen atmosphere. componen...
Description 60GHz Low Noise Amplifier

File Size 126.46K  /  8 Page

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    Mimix Broadband, Inc.
Part No. XP1020-BD-000V XP1020-BD-EV1
OCR Text ...dm6030hk-pt cured in a nitrogen atmosphere per manufacturer's cure schedule. apply epoxy sparingly to avoid getting any on to the top surface of the die. an epoxy fillet should be visible around the total die periphery. for additional info...
Description 11.0-19.0 GHz GaAs MMIC Power Amplifier

File Size 306.21K  /  6 Page

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For atmosphere Found Datasheets File :: 4772    Search Time::1.141ms    
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