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NE02132 78M10 61MCO ASI10690 2SB1707 331KL STBN024 PSKD44
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For crack Found Datasheets File :: 591    Search Time::1.844ms    
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    L7060-02

Hamamatsu Corporation
Part No. L7060-02
OCR Text ...cause the roots of the leads to crack, resulting in performance deterioration. This sometimes leads to wiring breakage. If the leads are soldered while external force is applied to the device, the residual force tends to degrade device perf...
Description    HIGH-POWER INFRARED PULSED LASER DIODE

File Size 89.90K  /  2 Page

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    TLP1031A

TOSHIBA[Toshiba Semiconductor]
Part No. TLP1031A
OCR Text ...ay cause the package to melt or crack. Care must be taken in relation to the environment in which the device is to be installed. Mount the device on a level surface. Output fluctuates for 100 ms after power-on while the internal circuit sta...
Description TOSHIBA Photointerrupter Infrared LED Photo IC

File Size 145.72K  /  7 Page

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    2SC6011A

Allegro MicroSystems
Part No. 2SC6011A
OCR Text ... may cause the case material to crack at the joint with the heatsink. Please pay special attention for this effect. When soldering the products, please be sure to minimize the working time, within the following limits: 2605C 10 s 3505C 3s ...
Description Audio Amplification Transistor

File Size 279.39K  /  7 Page

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    2SC6011

Allegro Micro Systems, Inc.
Allegro MicroSystems
Part No. 2SC6011
OCR Text ... may cause the case material to crack at the joint with the heatsink. Please pay special attention for this effect. When soldering the products, please be sure to minimize the working time, within the following limits: 2605C 10 s 3505C 3s ...
Description Audio Amplification Transistor

File Size 279.37K  /  7 Page

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For crack Found Datasheets File :: 591    Search Time::1.844ms    
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