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  diffusion Datasheet PDF File

For diffusion Found Datasheets File :: 1289    Search Time::1.562ms    
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    CXA2765ER

Sony Corporation
Part No. CXA2765ER
OCR Text ...egister setting of HFM spectrum diffusion function (Modulation frequency: 2 bits, diffusion frequency: 2 bits) Package 32-pin VQFN (Plastic) Structure CMOS IC Sony reserves the right to change products and specifications without ...
Description 5-channel 3-LD Driver for Optical Disk Drive

File Size 382.42K  /  32 Page

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    MA4E2532M-1113 MA4E2532M-1113T MA4E2532M-1113W MA4E2532L-1113 MA4E2532L-1113T MA4E2532L-1113W

M/A-COM Technology Solutions, Inc.
Part No. MA4E2532M-1113 MA4E2532M-1113T MA4E2532M-1113W MA4E2532L-1113 MA4E2532L-1113T MA4E2532L-1113W
OCR Text ... Multilayer Metalization with a diffusion Barrier, 100% Stabilization Bake (300C, 16 hours) * Lower Susceptibility to ESD Damage M/A-COM Products Rev. V3 Case Style 1113 A B Description The MA4E2532-1113 Series SURMOUNTTM Low...
Description SURMOUNTTM Low & Medium Barrier Silicon Schottky Diodes: Ring Quad Series

File Size 99.64K  /  4 Page

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    MADS-002545-1307 MADS-002545-1307H MADS-002545-1307HT MADS-002545-1307L MADS-002545-1307LG MADS-002545-1307LT MADS-00254

M/A-COM Technology Solutions, Inc.
Part No. MADS-002545-1307 MADS-002545-1307H MADS-002545-1307HT MADS-002545-1307L MADS-002545-1307LG MADS-002545-1307LT MADS-002545-1307M MADS-002545-1307HG
OCR Text ...Multilayer Metallization with a diffusion * Barrier, 100% Stabilization Bake (300 C, 16 hours) * Lower Susceptibility to ESD Damage Topview M/A-COM Products Rev. V3 A B Description and Applications The MADS-002545-1307 Series ...
Description SURMOUNTTM Schottky Diodes: Cross-Over Quad Series Ultra-Small 600x600um Surface-Mount Chip

File Size 56.46K  /  3 Page

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    MADS-002502-1246HP MADS-002502-1246LP MADS-002502-1246MP MA4E2502H-1246 MA4E2502H-1246T MA4E2502H-1246W MA4E2502L-1246 M

M/A-COM Technology Solutions, Inc.
Part No. MADS-002502-1246HP MADS-002502-1246LP MADS-002502-1246MP MA4E2502H-1246 MA4E2502H-1246T MA4E2502H-1246W MA4E2502L-1246 MA4E2502L-1246T MA4E2502L-1246W MA4E2502 MA4E2502H MA4E2502M-1246W MA4E2502M-1246T
OCR Text ... Multilayer Metalization with a diffusion Barrier, 100% Stabilization Bake (300C, 16 hours) * Lower Susceptibility to ESD Damage M/A-COM Products Rev. V7 The MA4E2502 Family of Surmount Schottky diodes are recommended for use in microwa...
Description SILICON, HIGH BARRIER SCHOTTKY, KU BAND, MIXER DIODE
SURMOUNTTM Low, Medium, and High Barrier Silicon Schottky Diodes

File Size 106.93K  /  5 Page

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    MA4E2514M-1116 MA4E2514M-1116T MA4E2514M-1116W MADS-002514-1116LP MADS-002514-1116MP MA4E2514L-1116 MA4E2514L-1116T MA4E

M/A-COM Technology Solu...
M/A-COM Technology Solutions, Inc.
Part No. MA4E2514M-1116 MA4E2514M-1116T MA4E2514M-1116W MADS-002514-1116LP MADS-002514-1116MP MA4E2514L-1116 MA4E2514L-1116T MA4E2514L-1116W
OCR Text ... Multilayer Metalization with a diffusion Barrier, 100 % Stabilization Bake (300C, 16 hours) * Lower Susceptibility to ESD Damage A M/A-COM Products Rev. V5 B Description The MA4E2514 SURMOUNTTM Diode Tee Series are Silicon Low,...
Description SURMOUNTTM Low and Medium Barrier Silicon Schottky Diodes: Tee Pair

File Size 95.19K  /  4 Page

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    MA4E2508MSP-T MADS-002508-1112HT MA4E2508L-1112 MA4E2508L-1112T MA4E2508L-1112W MA4E2508H-1112 MA4E2508H-1112W MA4E2508M

NXP Semiconductors N.V.
M/A-COM Technology Solutions, Inc.
Part No. MA4E2508MSP-T MADS-002508-1112HT MA4E2508L-1112 MA4E2508L-1112T MA4E2508L-1112W MA4E2508H-1112 MA4E2508H-1112W MA4E2508M-1112 MA4E2508M-1112W
OCR Text ... Multilayer Metalization with a diffusion Barrier, 100 % Stabilization Bake (300C, 16 hours) * Lower Susceptibility to ESD Damage M/A-COM Products Rev. V3 Case Style 1112 A B Description The MA4E2508 SURMOUNTTM Anti-Parallel ...
Description SILICON, LOW BARRIER SCHOTTKY, KU BAND, MIXER DIODE CASE 1112, 2 PIN
SURMOUNTTM Low, Medium, & High Barrier Silicon Schottky Diodes: Anti-Parallel Pair

File Size 94.71K  /  4 Page

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    AT3228SY9ZS-RV

Kingbright Corporation
Part No. AT3228SY9ZS-RV
OCR Text ...the known activation energy for diffusion is 0.4 - 0.48 eV. Accelerated soak times may vary due to material properties, e.g., mold compound, encapsulant, etc. JEDEC document JESD22-A120 provides a method for determining the diffusion coeffi...
Description 3.2X2.8mm SMD LED WITH CERAMIC SUBSTRATE

File Size 392.08K  /  10 Page

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    AT5050SE9ZS-RV

Kingbright Corporation
Part No. AT5050SE9ZS-RV
OCR Text ...the known activation energy for diffusion is 0.4 - 0.48 eV. Accelerated soak times may vary due to material properties, e.g., mold compound, encapsulant, etc. JEDEC document JESD22-A120 provides a method for determining the diffusion coeffi...
Description 5.0X5.0mm SMD LED WITH CERAMIC SUBSTRATE

File Size 401.78K  /  10 Page

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    AT5050QB10ZS-RV

Kingbright Corporation
Part No. AT5050QB10ZS-RV
OCR Text ...the known activation energy for diffusion is 0.4 - 0.48 eV. Accelerated soak times may vary due to material properties, e.g., mold compound, encapsulant, etc. JEDEC document JESD22-A120 provides a method for determining the diffusion coeffi...
Description 5.0X5.0mm SMD LED WITH CERAMIC SUBSTRATE

File Size 406.05K  /  10 Page

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    PX1011B PX1011B-EL1_G PX1011B-EL1G PX1011BI-EL1_G PX1011BI-EL1G

NXP Semiconductors
Part No. PX1011B PX1011B-EL1_G PX1011B-EL1G PX1011BI-EL1_G PX1011BI-EL1G
OCR Text ...1011BI-EL1/G[1] xxxxxxx 2PGyyww diffusion lot number manufacturing code: 2 = diffusion site P = assembly site G = lead-free yy = year code ww = week code [1] Industrial temperature range. Description full basic type number PX1011B_2 ...
Description PCI Express stand-alone X1 PHY

File Size 207.81K  /  30 Page

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For diffusion Found Datasheets File :: 1289    Search Time::1.562ms    
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