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  FMG-G26S Datasheet PDF File

For FMG-G26S Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

    FMG1G50US60 FMG1G50US60H

FAIRCHILD[Fairchild Semiconductor]
Part No. FMG1G50US60 FMG1G50US60H
Description Molding Type Module

File Size 624.70K  /  9 Page

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Amphenol Communications Solutions

Part No. L177HDAG26S
Description Dsub, Stamped Signal 3A, High Density, Straight Soldercup, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    FMG1G50US60L FMG1G50US60

FAIRCHILD[Fairchild Semiconductor]
Part No. FMG1G50US60L FMG1G50US60
Description Molding Type Module

File Size 598.46K  /  9 Page

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Amphenol Communications Solutions

Part No. L77HDAG26SOL2RM5C309
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.76m (30 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
Tech specs    

Official Product Page

    FMG2G100US60

Fairchild Semiconductor
Part No. FMG2G100US60
Description    Molding Type Module
IGBT

File Size 634.46K  /  9 Page

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Amphenol Communications Solutions

Part No. L177HRAG26S
Description Dsub, Straight, High Density, Housing only, Crimp & Poke, Bright Tin Shell, 26 Socket, M3 Rear Nut
Tech specs    

Official Product Page

    FMG2G75US120

FAIRCHILD[Fairchild Semiconductor]
Part No. FMG2G75US120
Description Molding Type Module

File Size 496.50K  /  7 Page

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Amphenol Communications Solutions

Part No. L77HDAG26SOL2C309
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.76m (30 in) Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

    FMG2G400LS60

Fairchild Semiconductor
Part No. FMG2G400LS60
Description 600V, 400A IGBT Module (Molding Type)
Molding Type Module

File Size 380.73K  /  6 Page

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Amphenol Communications Solutions

Part No. L177HDAG26SOL2RM5
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
Tech specs    

Official Product Page

    FMG2G300US60

Fairchild Semiconductor
Part No. FMG2G300US60
Description 600V, 300A IGBT Module (Molding Type)
Molding Type Module

File Size 549.85K  /  7 Page

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Amphenol Communications Solutions

Part No. L77HDAG26SOL2RM5
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Rear Threaded Insert, M3 Threaded Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
Tech specs    

Official Product Page

    FMG2G200US60

Fairchild Semiconductor
Part No. FMG2G200US60
Description 600V, 200A IGBT Module (Molding Type)
Molding Type Module

File Size 722.75K  /  7 Page

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Amphenol Communications Solutions

Part No. L77HDAG26SOL2
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

    FMG2G150US60

Fairchild Semiconductor
Part No. FMG2G150US60
Description 600V, 150A IGBT Module (Molding Type)
Molding Type Module

File Size 710.11K  /  7 Page

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Amphenol Communications Solutions

Part No. L77HDAG26SOL2RM8
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, Flash Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
Tech specs    

Official Product Page

    FMGA-461/883

Crane Aerospace & Electronics.
Part No. FMGA-461/883
Description EMI INPUT FILTER 28 VOLT INPUT SURFACE MOUNT

File Size 182.59K  /  6 Page

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Amphenol Communications Solutions

Part No. L177HDAG26SOL2RM8
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38m (15 in) Gold, M3 Fixed Front Screwlock, Standoff 6.0mm (0.236\\), With Boardlock 4.2mm (0.165\\)
Tech specs    

Official Product Page

    FMG1G200US60H

Fairchild Semiconductor
Part No. FMG1G200US60H
Description 600V, 200A IGBT Module (Molding Type)

File Size 548.14K  /  7 Page

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Amphenol Communications Solutions

Part No. L177HDAG26SOL2
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Socket, 0.38um (15u\\) Gold, M3 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

For FMG-G26S Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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Part: FMG-G26S
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