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  FZS115-2A10 Datasheet PDF File

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    Magnetrol International, Inc.
Part No. 8AA2A1006 8AA1A1006 8AA1A2006 8AA2A2006 8AA-1A1A-006
Description Kotron? RF Sensing Probes

File Size 322.98K  /  20 Page

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Amphenol Communications Solutions

Part No. 95278-502A10LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 10 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    EEEFK2A101AM EEEFK2A151AM

Panasonic Semiconductor
Part No. EEEFK2A101AM EEEFK2A151AM
Description Aluminum Electrolytic Capacitors

File Size 57.29K  /  2 Page

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Amphenol Communications Solutions

Part No. 98401-102A10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    LVH201B10H-1R0 LVH201B10H-R33 LVH252A10H LVH201B10H-2R2 LVH201B10H-R68 LVH252A12 LVH201B10H-R24 LVH201B10H-R47 LVH201B10

List of Unclassifed Manufacturers
Part No. LVH201B10H-1R0 LVH201B10H-R33 LVH252A10H LVH201B10H-2R2 LVH201B10H-R68 LVH252A12 LVH201B10H-R24 LVH201B10H-R47 LVH201B10H-R56 LVH252A12H
Description Sealed Power Inductors

File Size 310.12K  /  6 Page

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Amphenol Communications Solutions

Part No. 95278-802A10LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 10 Positions, 2.54 mm Pitch, 0.38um(15u\\) Gold plating
Tech specs    

Official Product Page

    26-48-1023 41681A02A102 0026481023

Molex Electronics Ltd.
Part No. 26-48-1023 41681A02A102 0026481023
Description 3.96mm (.156) Pitch KK Header, Breakaway, Vertical, Polarizing Wall, 2 Circuits, Tin (Sn) Plating

File Size 158.67K  /  6 Page

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Amphenol Communications Solutions

Part No. 95278-102A10LF
Description BergStik®, Board to Board connector, Unshrouded Header, SMT, Double Row, 10 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating
Tech specs    

Official Product Page

    Accutek Microcircuit, Corp.
Part No. CL32A106MOJNNNE
Description CAPACITOR, CERAMIC, MULTILAYER, 16 V, X5R, 10 uF, SURFACE MOUNT, 1210 CHIP, HALOGEN FREE & ROHS COMPLIANT

File Size 134.34K  /  2 Page

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Amphenol Communications Solutions

Part No. 95278-402A10LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Surface Mount, Double Row, 10 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    C1005X7S2A103MT

TDK Electronics
Part No. C1005X7S2A103MT
Description SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS

File Size 100.26K  /  1 Page

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Amphenol Communications Solutions

Part No. 10155502-A108KLF
Description Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Vertical, 8 Position, STG, Top Latch, Tin (preplated)<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs    

Official Product Page

    C1608X7S2A104KT

TDK Electronics
Part No. C1608X7S2A104KT
Description SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS

File Size 99.36K  /  1 Page

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Amphenol Communications Solutions

Part No. 10155502-A107KLF
Description Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Vertical, 7 Position, STG, Top Latch, Tin (preplated)<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs    

Official Product Page

    C1005X7S2A103KT

TDK Electronics
Part No. C1005X7S2A103KT
Description SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS

File Size 100.79K  /  1 Page

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Amphenol Communications Solutions

Part No. 10155552-A109KLF
Description Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Header Vertical, Tin (preplated)
Tech specs    

Official Product Page

    C5750X7S2A106MT

TDK Electronics
Part No. C5750X7S2A106MT
Description SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS

File Size 99.51K  /  1 Page

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Amphenol Communications Solutions

Part No. 10155552-A102KLF
Description Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Header Vertical, Tin (preplated)
Tech specs    

Official Product Page

    C2012X7S2A105KT

TDK Electronics
Part No. C2012X7S2A105KT
Description SPECIFICATION FOR TDK MULTILAYER CERAMIC CHIP CAPACITORS

File Size 100.42K  /  1 Page

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Amphenol Communications Solutions

Part No. NTHBR12A1001SR
Description NETbridge+ 1x2, Right Angle , Unseal A code ,100MΩ insulation resistance,Surface Mount termination.
Tech specs    

Official Product Page

For FZS115-2A10 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | <14> | 15 |   

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