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solder-bond Datasheet PDF File

For solder-bond Found Datasheets File :: 2031 Search Time::3.219ms
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				Freescale Semiconductor, Inc
Part No.	MPXHZ6250A MPXHZ6250A6T1 MPXHZ6250A6U MPXHZ6250AC6T1
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boar...
Description	High Temperature Accuracy Integrated Silicon Pressure Sensor
File Size	167.02K / 11 Page	View it Online	Download Datasheet

				Freescale Semiconductor... Freescale Semiconductor, Inc
Part No.	MPXV5010 MPXV5010G MPXV5010G6U MPXV5010GC6T1 MPXV5010GC6U MPXV5010GC7U MPVZ5010 MPX501009 MPX5010GS MPX5010 MPX5010GSX MPX5010DP MPVZ5010G7U MPVZ5010G6T1 MZ5010GW
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards wit...
Description	Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
File Size	450.31K / 23 Page	View it Online	Download Datasheet

				FREESCALE[Freescale Semiconductor, Inc]
Part No.	MPXHZ6115AC6U MPXAZ6115A MPXAZ6115A6T1 MPXAZ6115A6U MPXAZ6115AC6T1 MPXAZ6115AC6U MPXAZ6115AP MPXAZ6115APT1 MPXHZ6115A MPXHZ6115A6T1 MPXHZ6115A6U MPXHZ6115AC6T1
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boar...
Description	Media Resistant and High Temperature Accuracy Integrated Silicon Pressure Sensor
File Size	342.54K / 15 Page	View it Online	Download Datasheet

				MOTOROLA INC
Part No.	MPX4250A
OCR Text	...e correct size to ensure proper solder connection inter- face between the board and the package. with the correct fottprint, the packages will self align when subjected to a solder reflow process. it is always recommended to design boards w...
Description	ABSOLUTE, PEIZORESISTIVE PRESSURE SENSOR, 2.9-36.25Psi, 1.5%, 0.20-4.90V, ROUND, THROUGH HOLE MOUNT
File Size	74.64K / 5 Page	View it Online	Download Datasheet

				Motorola
Part No.	MPXHZ6115A
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. with the correct pad geometry, the packages will self-align when subjected to a solder reflow process. it is always recommended to fabricate ...
Description	(MPXHZ6115A / MPXHA6115A) Media Resistant and High Temperature Accuracy Integrated Silicon Pressure Sensor
File Size	273.56K / 12 Page	View it Online	Download Datasheet

				Freescale Semiconductor, Inc
Part No.	MPVZ5150 MPVZ515010
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. with the correct footprint, the packages will se lf align when subjected to a solder reflow process. it is always recommended to design board...
Description	Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated
File Size	109.97K / 8 Page	View it Online	Download Datasheet

				Motorola
Part No.	MPX4100A
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards wit...
Description	MPX4100A Integrated Silicon Pressure Sensor Manifold Absolute Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated From old datasheet system Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications
File Size	154.63K / 10 Page	View it Online	Download Datasheet

				Lite-On Technology Corporation
Part No.	LTL2P3TBKL14-MS
OCR Text	...on /W Copper + Silver Plating / Solder CRITICAL POINT ( SC ) N/A N/A SC for Dice shear SC for Wire pull test & Bond shear N/A Part No. : LTL2P3TBKL14-MS BNS-OD-C131/A4 Page : 2 of 11 LITE-ON TECHNOLOGY CORPORATION ...
Description	Property of Lite-On Only
File Size	405.21K / 11 Page	View it Online	Download Datasheet

				Motorola Semiconductor Products Inc
Part No.	MPX4100AS MPX4100AP
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards wit...
Description	Signal Conditioner, Other - Datasheet Reference From old datasheet system
File Size	113.96K / 10 Page	View it Online	Download Datasheet

				Freescale Semiconductor, Inc
Part No.	MPXV5050V
OCR Text	...e correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boar...
Description	High Temperature Accuracy Integrated Silicon Pressure Sensor
File Size	83.66K / 8 Page	View it Online	Download Datasheet

For solder-bond Found Datasheets File :: 2031 Search Time::3.219ms
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