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  44262-4406 Datasheet PDF File

For 44262-4406 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    Wurth Elektronik GmbH &...
Part No. 7440680047
Description POWER-CHOKE WE-TPC 8012

File Size 172.50K  /  3 Page

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Amphenol Communications Solutions

Part No. 92634-406HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 6 Positions, 2.54 mm Pitch, Right Angle, 8.08 mm (0.318in) Mating, 8.08 mm (0.318in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Wurth Elektronik GmbH &...
Part No. 7440680082
Description POWER-CHOKE WE-TPC 8012

File Size 172.42K  /  3 Page

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Amphenol Communications Solutions

Part No. 61082-164406LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 160 Positions.
Tech specs    

Official Product Page

    0440671403 44067-1403

Molex Electronics Ltd.
Part No. 0440671403 44067-1403
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 14 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selecti
MOLEX Connector

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 10117984-4060HLF
Description QSFP+ Cable Assemblies, Cable Assemblies, 26AWG, Eyemax: 16 Signal/ 9 Ground; QSFP+: 38 Positions, 6.00mm (0.236in) Length.
Tech specs    

Official Product Page

    Wurth Elektronik GmbH &...
Part No. 7440680017
Description POWER-CHOKE WE-TPC 8012

File Size 172.39K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-104406LF
Description BERGSTAK 0.8MM
Tech specs    

Official Product Page

    0440671401 44067-1401

Molex Electronics Ltd.
Part No. 0440671401 44067-1401
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB
3.00mm (.118") Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB
MOLEX Connector

File Size 204.10K  /  3 Page

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Amphenol Communications Solutions

Part No. 61083-124406LF
Description BergStak® 0.80mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 120 Positions.
Tech specs    

Official Product Page

    MOLEX INC
Part No. 0440671401
Description 14 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER

File Size 29.77K  /  2 Page

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Amphenol Communications Solutions

Part No. 61082-024406LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 20 Positions.
Tech specs    

Official Product Page

    44067-0403 0440670403

Molex Electronics Ltd.
Part No. 44067-0403 0440670403
Description 3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
3.00mm (.118") Pitch Micro-Fit 3.0垄芒 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140") Thick PCB, 4 Circuits, 0.76楼矛m (30楼矛") Gold (Au) Selectiv

File Size 204.16K  /  3 Page

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Amphenol Communications Solutions

Part No. 61082-064406LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 60 Positions.
Tech specs    

Official Product Page

    Wurth Elektronik GmbH &...
Part No. 7440660035
Description POWER-CHOKE WE-TPC

File Size 108.48K  /  3 Page

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Amphenol Communications Solutions

Part No. 61082-124406LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 120 Positions.
Tech specs    

Official Product Page

    Wurth Elektronik GmbH &...
Part No. 7440660022
Description POWER-CHOKE WE-TPC

File Size 108.45K  /  3 Page

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Amphenol Communications Solutions

Part No. 10093084-4065LF
Description QSFP+ Cable Assembly, 26 AWG, 6.5ms, passive, non-halogen free
Tech specs    

Official Product Page

    44067-1801 0440671801

Molex Electronics Ltd.
Part No. 44067-1801 0440671801
Description 3.00mm (.118) Pitch Micro-Fit 3.0?/a> Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating
3.00mm (.118) Pitch Micro-Fit 3.0 Wire-to-Board Header, Dual Row, Vertical for up to 3.56mm (.140) Thick PCB, 18 Circuits, Tin (Sn) Plating

File Size 203.94K  /  3 Page

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Amphenol Communications Solutions

Part No. 10155244-06111LF
Description Minitek® 1.25mm Latch,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 6 Position., Top Latch, Tin (preplated)
Tech specs    

Official Product Page

For 44262-4406 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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