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  90130-1310 Datasheet PDF File

For 90130-1310 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    90130-1208 0901301208

Molex Electronics Ltd.
Part No. 90130-1208 0901301208
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded 8 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded 8 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 68690-130HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    90130-1206 0901301206

Molex Electronics Ltd.
Part No. 90130-1206 0901301206
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Dual Row, Vertical, Shrouded, Fully Loaded, 6 Circuits, Black, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating

File Size 586.12K  /  7 Page

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Amphenol Communications Solutions

Part No. 69190-130HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 30 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0901301134 90130-1134

Molex Electronics Ltd.
Part No. 0901301134 90130-1134
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 34 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 586.18K  /  7 Page

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Amphenol Communications Solutions

Part No. 78290-130HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 30 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    0901301136 90130-1136

Molex Electronics Ltd.
Part No. 0901301136 90130-1136
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 36 Circuits, Black, 3μm (118μ) Tin(Sn) over Nickel (Ni), Lead free

File Size 586.02K  /  7 Page

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Amphenol Communications Solutions

Part No. 92090-130LF
Description Minitek® 2.00mm, Board to Board, PCB mounted Receptacle, Vertical, Surface Mount, Double Row, Top Entry, 30 Positions, 2.00mm (0.079in) Pitch..
Tech specs    

Official Product Page

    0901303318 90130-3318

Molex Electronics Ltd.
Part No. 0901303318 90130-3318
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 18 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. 10065490-130TRLF
Description Minitek® 2.00mm, Board To Board, Receptacle, Vertical, Surface Mount, Double Row, 30 Positions, 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

    0901303316 90130-3316

Molex Electronics Ltd.
Part No. 0901303316 90130-3316
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Right Angle, Shrouded, Fully Loaded, 16 Circuits, Black 0.76μm (30μ) Gold (Au) Selective Plating

File Size 168.61K  /  4 Page

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Amphenol Communications Solutions

Part No. L17H2990130
Description Dsub, Stamped Signal 3A, Dual Port Right Angle PCB Thru Hole, F=19.05mm (0.750in), 26/26 (Socket/Socket), Flash Gold, Bright Tin Shell, 4-40 Threaded Rear Insert, 4*Arrowhead Boardlock
Tech specs    

Official Product Page

    0510901300 51090-1300

Molex Electronics Ltd.
Part No. 0510901300 51090-1300
Description 2.00mm (.079) Pitch Mi II?/a> System Wire-to-Board Crimp Housing, Single Row, 13Circuits
2.00mm (.079) Pitch Mi II System Wire-to-Board Crimp Housing, Single Row, 13Circuits

File Size 87.21K  /  2 Page

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Amphenol Communications Solutions

Part No. 10061913-103DLF
Description PCI Express® Gen 3 Card Edge Connectors, Storage and Server System, Vertical, Surface Mount, 164 Position.
Tech specs    

Official Product Page

    0901301108 90130-1108

Molex Electronics Ltd.
Part No. 0901301108 90130-1108
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 8 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.90K  /  7 Page

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Amphenol Communications Solutions

Part No. 77313-102-68LF
Description BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 68 Positions
Tech specs    

Official Product Page

    0901301106 90130-1106

Molex Electronics Ltd.
Part No. 0901301106 90130-1106
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded 6 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.88K  /  7 Page

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Amphenol Communications Solutions

Part No. 77313-103-34LF
Description BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical Header, Through Hole, Double Row, 34 Positions
Tech specs    

Official Product Page

    0901301110 90130-1110

Molex Electronics Ltd.
Part No. 0901301110 90130-1110
Description 2.54mm (.100) Pitch C-Grid III Header, Dual Row, Vertical, Shrouded, Fully Loaded, 10 Circuits, Black, 3μm (118μ) Tin (Sn) over Nickel (Ni)

File Size 585.90K  /  7 Page

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Amphenol Communications Solutions

Part No. 10044013-10310T
Description PCI Express® GEN 1 Card Edge, Storage and Server Connector, Vertical, Press-Fit, 280 Positions, 1.00mm (0.039in) Pitch
Tech specs    

Official Product Page

For 90130-1310 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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