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Toshiba Electronic Devices & Storage Corporation |
| Part No. |
XPH13016MC
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| Description |
P-ch MOSFET, -60 V, -60 A, 0.0099 Ω@-10V, SOP Advance(WF)
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0850030165 85003-0165
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| Description |
2.54mm (.100") Pitch DIN 41612 Header, Style C, Vertical, Through Hole, 0.6渭m (24渭")Selective Gold (Au), 64 Circuits, Lead free
2.54mm (.100) Pitch DIN 41612 Header, Style C, Vertical, Through Hole, 0.6μm (24μ)Selective Gold (Au), 64 Circuits, Lead free
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| File Size |
70.40K /
3 Page |
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it Online |
Download Datasheet
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Molex Electronics Ltd.
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| Part No. |
0736443016 73644-3016
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| Description |
2.00mm (.079") Pitch HDM庐 Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits
2.00mm (.079) Pitch HDM? Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 144 Circuits
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| File Size |
164.68K /
4 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0908143016 90814-3016
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| Description |
1.27mm (.050") Pitch Picoflex PF-50 Header, Vertical, Low Profile, Surface Mount, 16 Circuits, Glow Wire Compatible
1.27mm (.050) Pitch Picoflex PF-50 Header, Vertical, Low Profile, Surface Mount, 16 Circuits, Glow Wire Compatible
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| File Size |
236.69K /
4 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0879143016 87914-3016
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Bom2Buy.com
Price and Availability
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