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79D05 DSPIC TX1264NL CDBD1530 VRE100CA SIC403 ARS124H SRF1318
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For bonded Found Datasheets File :: 5353    Search Time::4.203ms    
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    SIEMENS AG
SIEMENS A G
Part No. SLE4432M2.2 SLE4442M2.2 SLE4442C
OCR Text ...e sle 4432 m2.2 on request wire-bonded module m2.2 sle 4432 c on request chip sle 4442 m2.2 on request wire-bonded module m2.2 sle 4442 c on request chip 1) values are temperature dependent, for further information please refer to your siem...
Description ICs for Chip Cards Intelligent 256-Byte EEPROM

File Size 1,006.35K  /  35 Page

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Intersil, Corp.
Holtek Semiconductor In...
Part No. HT48R50-28SDIP-B-0 HT48R32-18DIP-A-0 HT48R11-24SDIP-B-0 HT48R12-24SDIP-B-0 HT48R31-28SDIP-B-0 HT48R11-20DIP-F-0 HT48R31-20DIP-F-0 HTR48R12-20DIP-F-0 HT48R32-28SDIP-B-0 HT48R31-18DIP-A-0 HT48R11-18DIP-F-0 HT48R12-18DIP-F-0 HT48C10 HT48C50 HT48C30
OCR Text ...e tmr0 and tmr1 pads have to be bonded to vdd or vss if the tmr0 and/or tmr1 pad are not used. the (tmr0) int indicates that the tmr0 pad should be bonded to the int pin. the pc5 (tmr1) indicates that the tmr1 pad should be bonded to the ...
Description 8-Bit Microcontroller Series
IC-8-BIT MCU 集成电路8位微控制

File Size 2,638.37K  /  59 Page

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    HT600 HT6207 3_18E HT680 HT620720SOP HT620720DIP HT60020DIP

Holtek Semiconductor In...
HOLTEK[Holtek Semiconductor Inc]
Holtek Semiconductor Inc.
Holtek Semiconductor, Inc.
http://
Part No. HT600 HT6207 3_18E HT680 HT620720SOP HT620720DIP HT60020DIP
OCR Text ...ernally trinary programmable if bonded out. It is otherwise set floating internally. Various packages of the 318 encoders offer flexible combinations of programmable address/data to meet various application needs. The programmable address/d...
Description Remote-Control Transmitter/Encoder
From old datasheet system
318 Series of Encoders
3^18 Series of Eecoders For Remote Control System Applications(3^18系列编码器(地址线:9条;地址数据线:5条),用于远程控制系 3 ^ 18系列Eecoders对于远程控制系统的应用(3 ^ 18系列编码器(地址线:9地址数据线:5条),用于远程控制系统)
3^18 Series of Eecoders For Remote Control System Applications(3^18系列编码器(地址线:8条;地址数据线:4条),用于远程控制系 3 ^ 18系列Eecoders对于远程控制系统的应用(3 ^ 18系列编码器(地址线:8地址数据线:4条),用于远程控制系统)

File Size 126.04K  /  11 Page

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    Cypress
Part No. CYV15G0201DXB
OCR Text ...an be operated independently or bonded to form wider buses. each channel can accept either 8-bit data characters or pre-encoded 10-bit transmission characters. data characters are passed from the transmit input register to an embedded 8b/10...
Description Dual-channel HOTLink IITM Transceiver

File Size 448.00K  /  47 Page

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    Holtek Semiconductor In...
Part No. HT82D22A
OCR Text ...up options: pa0~pa7 pa6 is wire-bonded with tmr0 pa7 is wire-bonded with tmr1 pb0/fsk-b_out i/o pull-high wake-up bidirectional 1-bit input/output port. software instructions deter - mine the cmos output or schmitt trigger input with pull-h...
Description 27MHz Two Channel RX 8-Bit MCU

File Size 307.16K  /  41 Page

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    SLE4428 SLE4418

Siemens Semiconductor Group
Part No. SLE4428 SLE4418
OCR Text ...p sle 4418 m2.2 on request wire-bonded module m2.2 sle 4428 c on request chip sle 4428 m2.2 on request wire-bonded module m2.2 m2.2 semiconductor group 1 04.94 semiconductor group 2 sle 4418 sle 4428 pin ...
Description (SLE4418 / SLE4428) ICs for Chip Cards

File Size 428.36K  /  17 Page

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    Analog Devices, Inc.
Part No. AD6432 AD6432AST
OCR Text ...n function 1 gnd pcb ground not bonded to ic 2 modo tx modulator output ac coupled, drives 150 w into 50 w 3 vpdv lo2 divided by 2 supply voltage v pos 4 cmtx on-chip tx mixer common ground 5 lolo differential rx mixer lo2 input negative...
Description GSM 3 V Transceiver IF Subsystem
Ceramic Multilayer Capacitor; Capacitance:100000pF; Capacitance Tolerance: /- 10 %; Working Voltage, DC:50V; Dielectric Characteristic:X7R; Series:20110; Packaging:Cut Tape TELECOM, CELLULAR, BASEBAND CIRCUIT, PQFP44

File Size 337.69K  /  20 Page

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    SAMSUNG SEMICONDUCTOR CO. LTD.
Part No. K4R881869 K4R881869M-NCK8 K4R881869M-NBCCG6
OCR Text ...p inouts and definitions center-bonded devices - preliminary these tables shows the pin assignments of the center-bonded rdram package. the mechanical dimensions of this package are shown in a later section. refer to section ? center-bo...
Description 288Mbit RDRAM 512K x 18 bit x 2*16 Dependent Banks Direct RDRAMTM

File Size 4,098.44K  /  64 Page

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